The overmolded plastic (OMP) package structure is similar to that of an integrated circuit, with a copper flange and a molded body, but discrete wire bonds are used in the matching network for improved RF performance.
OMP packages have a number of outlines, from the HVQFN package for low power drivers, to PQFN package for higher power drivers, and the SOT502 format of packages for dual path MMICs, and discretes. OMP is an ideal package for low frequency and low power applications. For the highest performance applications, where the last percentage and decibel matter, air-cavity packages remain the best option.
The wide range of packages offered by Ampleon enables you to select the right device precisely optimized for your application and allows to find the best compromise between cost and performance.