Packaging plays a critical role in RF power transistors, influencing both their cost-efficiency and performance. Because peak power levels can vary significantly - from as low as 5 W to over 1 kW - a variety of packaging options is required to accommodate diverse applications. The choice of package format, such as air-cavity or overmolded plastic, typically depends on design requirements and the trade-offs between performance and cost.
The traditional package for RF power transistors is the ACC with a ceramic lid. The package is made of three main parts: flange, ringframe and lid.
The structure of ACP is similar to ACC but the lid and ringframe are glued and are made of a polymer instead of ceramic.
OMP is a lead frame based plastic package having leads protruding from the side portion of the package and a bottom metal flange for high-power thermal dissipation.
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