LDMOS 3-stage integrated Doherty MMIC

The B10G3336N16DL is a 3-stage 16 W fully integrated Doherty MMIC solution using Ampleon's state of the art LDMOS technology. The carrier and peaking device, input splitter, output combiner, and output matching are integrated in a single package. This multiband device is perfectly suited as a general-purpose device in the frequency range from 3300 MHz to 3600 MHz. Available in LGA outline.

Features and benefits

  • Integrated input splitter
  • Integrated output combiner
  • Very high efficiency
  • Designed for broadband operation (frequency 3300 MHz to 3600 MHz)
  • Designed for ultra VBW
  • Independent control of carrier and peaking bias
  • Integrated ESD protection
  • Excellent thermal stability
  • High power gain, input and output matched to impedance 50 Ω
  • For RoHS compliance see the product details on the Ampleon website

Applications

  • RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA, LTE and NR small cell base stations in the 3300 MHz to 3600 MHz frequency range

Parametrics

Symbol Parameter Conditions Min Typ/Nom Max Unit
frange frequency range 3300 3600 MHz
PL(3dB) nominal output power at 3 dB gain compression 16 W
Test signal: CW pulsed
VDS drain-source voltage [0] 28 V
Gp power gain [0] 32 35 dB
ηD drain efficiency [0] 27 32 %
RLin input return loss [0] -14 -8 dB

Package / Packing

Type number Package Outline version Reflow-/Wave
soldering
Packing Product status Marking Orderable part number,
(Ordering code (12NC))
B10G3336N16DL LGA-7x7-20-2
(LGA-7x7-20-2)
lga-7x7-20-2_po TR13; 3000-fold; 16 mm; dry pack Active Standard Marking B10G3336N16DLX
(9349 606 42525)
TR13; 1000-fold; 16 mm; dry pack Active Standard Marking B10G3336N16DLZ
(9349 606 42515)

Pinning info

Pin Symbol Description Simplified outline Graphic symbol
1 VGS_P gate-source voltage of peaking
2 NC not connected (connection to ground is allowed)
3 GND ground (connection to ground is required)
4 RFin RF input
5 GND ground (connection to ground is required)
6 GND ground (connection to ground is required)
7 VDS1 drain-source voltage of driver stages
8 NC not connected (connection to ground is allowed)
9 VDS2 drain-source voltage of final stages
10 GND ground (connection to ground is required)
11 GND ground (connection to ground is required)
12 RFout RF output
13 GND ground (connection to ground is required)
14 NC not connected (connection to ground is allowed)
15 NC not connected (connection to ground is allowed)
16 GND ground (connection to ground is required)
17 NC not connected (connection to ground is allowed)
18 GND ground (connection to ground is required)
19 VDS1 drain-source voltage of driver stages
20 VGS_C gate-source voltage of carrier
21 GND RF ground (connection to ground is required)

Ordering & availability

Type number Ordering code (12NC) Orderable part number Distributor Buy online Samples
B10G3336N16DL 9349 606 42525 B10G3336N16DLX DigiKey Buy Not available
RFMW Buy
B10G3336N16DL 9349 606 42515 B10G3336N16DLZ RFMW Buy Request samples

Ordering & availability

Type number Ordering code (12NC) Orderable part number Distributor Buy online Samples
B10G3336N16DL 9349 606 42525 B10G3336N16DLX DigiKey Buy Not available
RFMW Buy
B10G3336N16DL 9349 606 42515 B10G3336N16DLZ RFMW Buy Request samples

Design support

Title Type Date
Printed-Circuit Board (PCB) B10G3336N16DL (Data sheet) Design support 2023-10-02