LDMOS 2-stage integrated Doherty MMIC

The B10H0710N40D is a dual section 2-stage fully integrated Doherty MMIC solution using Ampleon's state of the art 50 V LDMOS technology. The carrier and peaking device, input splitter, output combiner and pre-match are integrated in each section. This multiband device is perfectly suited as general purpose driver in the frequency range 700 MHz to 1 GHz. Available in LGA outline.

Features and benefits

  • Integrated input splitter
  • Integrated output combiner
  • Source impedance 50 Ω
  • Pre-matched output
  • No output circulator needed thanks to quad-combined configuration
  • High linearity
  • Designed for large RF and instantaneous bandwidth operation
  • Independent control of carrier and peaking bias
  • Integrated ESD protection
  • High power gain
  • For RoHS compliance see the product details on the Ampleon website

Applications

  • 4G/5G macrocell base station driver
  • 4G/5G microcell base station

Downloads

Datasheet
All application notes
All documentation

All documents

Design tool

RF Power Lifetime Calculator

Transistor:
B10H0710N40D

LDMOS 2-stage integrated Doherty MMIC

°C

Parametrics

Symbol Parameter Conditions Min Typ/Nom Max Unit
frange frequency range 700 1000 MHz
PL(1dB) nominal output power at 1 dB gain compression 50 W
Test signal: Pulsed CW
VDS drain-source voltage [0] 48 V
Gp power gain PL = 2.51 W (34 dBm) [0] 27 31 35 dB
ηD drain efficiency PL = 2.51 W (34 dBm) [0] 20 25 %
ηD drain efficiency PL = PL(1db) [0] 50 54 %
RLin input return loss PL = 2.51 W (34 dBm) [0] -20 -10 dB

Package / Packing

Type number Package Outline version Reflow-/Wave
soldering
Packing Product status Marking Orderable part number,
(Ordering code (12NC))
B10H0710N40D LGA-12x8
(LGA-12x8-34-2)
lga-12x8-34-2_po TR13; 3000-fold; 24 mm; dry pack Active Standard Marking B10H0710N40DX
(9349 606 85525)
TR7; 500-fold; 24 mm; dry pack Active Standard Marking B10H0710N40DYZ
(9349 606 85535)

Pinning info

Pin Symbol Description Simplified outline Graphic symbol
1 n.c not connected
2 n.c. not connected
3 decoupling_A video-lead for decoupling of section A
4 n.c. not connected
5 VGS(carr) gate-source voltage of carrier
6 VGS(peak) gate-source voltage of peaking
7 n.c. not connected
8 VDS1_A drain-source voltage of driver stages of section A
9 n.c. not connected
10 c.t.g. connect to ground
11 RF_IN_A RF input of section A
12 GND ground
13 GND ground
14 RF_IN_B RF input of section B
15 c.t.g. connected to ground
16 n.c. not connected
17 VDS1_B drain-source voltage of driver stages of section B
18 n.c. not connected
19 VGS(peak) gate-source voltage of peaking
20 VGS(carr) gate-source voltage of carrier
21 n.c. not connected
22 decoupling_B video-lead for decoupling of section B
23 n.c. not connected
24 n.c. not connected
25, 26, 27 RF_OUT_B/VDS2_B RF output and drain-source voltage of final stages of section B
28 n.c. not connected
29 GND ground
30 GND ground
31 n.c. not connected
32, 33, 34 RF_OUT_A/VDS2_A RF output and drain-source voltage of final stages of section A

Ordering & availability

Type number Ordering code (12NC) Orderable part number Distributor Buy online Samples
B10H0710N40D 9349 606 85525 B10H0710N40DX DigiKey Buy Not available
B10H0710N40D 9349 606 85535 B10H0710N40DYZ RFMW Buy Request samples

Ordering & availability

Type number Ordering code (12NC) Orderable part number Distributor Buy online Samples
B10H0710N40D 9349 606 85525 B10H0710N40DX DigiKey Buy Not available
B10H0710N40D 9349 606 85535 B10H0710N40DYZ RFMW Buy Request samples

Design support

Title Type Date
Printed-Circuit Board (PCB) B10H0710N40D (Data sheet) Design support 2023-10-02