BLM10D1822-61ABG
Download datasheetBLM10D1822-61ABG
Download datasheetLDMOS 2-stage integrated Doherty MMIC
The BLM10D1822-61ABG is a 2-stage fully integrated Doherty MMIC solution using Ampleon’s state of the art GEN10 LDMOS technology. The carrier and peaking device, input splitter and output combiner are integrated in a single package. This multiband device is perfectly suited as general purpose driver in the frequency range from 1800 MHz to 2200 MHz. Available in gull wing.
Features and benefits
- Integrated input splitter
- Integrated output combiner
- High efficiency
- Designed for broadband operation (frequency 1800 MHz to 2200 MHz)
- Integrated temperature compensated bias
- Independent control of carrier and peaking bias
- Integrated ESD protection
- Excellent thermal stability
- Source impedance 50 Ω; high power gain
- For RoHS compliance see the product details on the Ampleon website
Applications
- RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA and LTE base stations in the 1800 MHz to 2200 MHz frequency range
Parametrics
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 1800 | 2200 | MHz | ||
| PL(3dB) | nominal output power at 3 dB gain compression | 60 | W | |||
| Test signal: Pulsed CW | ||||||
| VDS | drain-source voltage | [0] [1] | 28 | V | ||
| PL(AV) | average output power | [0] [1] | 10 | W | ||
| Gp | power gain | f = 200 MHz [0] [1] | 26.5 | 28.5 | 30.5 | dB |
| ηD | drain efficiency | PL = 10 W (40 dBm) [0] [1] | 40 | 45 | % | |
| ηD | drain efficiency | PL = PL(3dB) [0] [1] | 44 | 51 | % | |
| RLin | input return loss | [0] [1] | -15 | -10 | dBm | |
| PL(3dB) | output power at 3 dB gain compression | [0] [1] | 47.1 | 47.8 | dBm | |
Package / Packing
| Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM10D1822-61ABG | OMP-400-8G-1 (OMP-400-8G-1) |
omp-400-8g-1_po | Tray, NonBakeable, Multiple in Drypack | Active | Standard Marking |
BLM10D1822-61ABGZ (9349 602 95517) |
|
| Reel 13" Q1/T1 in Drypack | Active | Standard Marking |
BLM10D1822-61ABGYZ (9349 602 95535) |
Pinning info
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 1 | VDS1 | drain-source voltage of driver stages |
|
|
| 2 | VGS(P) | gate-source voltage of peaking P | ||
| 3 | VGS(C) | gate-source voltage of carrier C | ||
| 4 | RF_IN | RF input | ||
| 5 | VGS(C) | gate-source voltage of carrier C | ||
| 6 | VGS(P) | gate-source voltage of peaking P | ||
| 7 | VDS1 | drain-source voltage of driver stages | ||
| 8 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
| flange | GND | RF ground |
Ordering & availability
| Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
|---|---|---|---|---|---|
| BLM10D1822-61ABG | 9349 602 95517 | BLM10D1822-61ABGZ | DigiKey | Buy | Request samples |
| RFMW | Buy | ||||
| BLM10D1822-61ABG | 9349 602 95535 | BLM10D1822-61ABGYZ | RFMW | Buy | Not available |
Ordering & availability
| Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
|---|---|---|---|---|---|
| BLM10D1822-61ABG | 9349 602 95517 | BLM10D1822-61ABGZ | DigiKey | Buy | Request samples |
| RFMW | Buy | ||||
| BLM10D1822-61ABG | 9349 602 95535 | BLM10D1822-61ABGYZ | RFMW | Buy | Not available |
Documentation
| Title | Type | Date | |
|---|---|---|---|
| LDMOS 2-stage integrated Doherty MMIC | Data sheet | 2020-10-19 | |
| Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-08-14 | |
| Mounting and Soldering of RF transistors in Air Cavity Packages | Application note | 2022-09-15 | |
| Packages for RF Power Transistors | Leaflet | 2024-03-25 | |
| LDMOS Ruggedness Reliability | Other type | 2017-03-28 | |
| Efficiency Improvement of LDMOS Transistors for Base Stations: Towards the Theoretical Limit | Other type | 2017-05-02 | |
| LDMOS Technology for RF Power Amplifiers | Other type | 2017-05-03 | |
| RF Power Solutions for Wireless Infrastructure | Brochure | 2024-04-04 |
Design support
| Title | Type | Date | |
|---|---|---|---|
| Printed-Circuit Board (PCB) BLM10D1822-61ABG (Data sheet) | Design support | 2020-10-21 |