Chemical content BLM9D3842-16AM

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Type number Package Package
description
Total product
weight
BLM9D3842-16AM LGA-7x7-20-2 LGA-7x7-20-2 382.543 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960536515 2022-08-19 02 3 245 30 seconds 3 221 20 seconds 3 CN
934960536525 2022-08-19 02 3 245 30 seconds 3 221 20 seconds 3 CN
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Capacitor Oxide Ceramics Calcium Oxide (CaO) 1305-78-8 0.029 8.700 0.008
Silica -amorphous- 7631-86-9 0.011 3.350 0.003
Zirconium Dioxide (ZrO2) 1314-23-4 0.029 8.650 0.008
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.002 0.660 0.001
Tin solder Tin (Sn) 7440-31-5 0.007 1.990 0.002
Polymer Boric Anhydride (B2O3) 1303-86-2 0.001 0.160 0.000
Silica -amorphous- 7631-86-9 0.000 0.000 0.000
Copper alloy Copper (Cu) 7440-50-8 0.252 76.490 0.066
Subtotal 0.331 100.000 0.088
Capacitor Oxide Ceramics Barium Oxide (BaO) 1304-28-5 0.426 43.000 0.111
Titanium Dioxide (TiO2) 13463-67-7 0.213 21.500 0.056
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.026 2.580 0.007
Tin solder Tin (Sn) 7440-31-5 0.061 6.130 0.016
Polymer Boric Anhydride (B2O3) 1303-86-2 0.005 0.520 0.001
Silica -amorphous- 7631-86-9 0.021 2.080 0.005
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.022 2.260 0.006
Copper alloy Copper (Cu) 7440-50-8 0.217 21.930 0.057
Subtotal 0.991 100.000 0.259
Capacitor Oxide Ceramics Zirconium Dioxide (ZrO2) 1314-23-4 0.057 8.650 0.015
Calcium Oxide (CaO) 1305-78-8 0.057 8.700 0.015
Silica -amorphous- 7631-86-9 0.022 3.350 0.006
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.004 0.660 0.001
Tin solder Tin (Sn) 7440-31-5 0.013 1.990 0.003
Polymer Boric Anhydride (B2O3) 1303-86-2 0.001 0.160 0.000
Silica -amorphous- 7631-86-9 0.000 0.000 0.000
Copper alloy Copper (Cu) 7440-50-8 0.505 76.490 0.132
Subtotal 0.659 100.000 0.172
Capacitor N/A Calcium Oxide (CaO) 1305-78-8 0.167 27.840 0.044
Zirconium Dioxide (ZrO2) 1314-23-4 0.209 34.820 0.055
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.017 2.870 0.004
Tin solder Tin (Sn) 7440-31-5 0.039 6.430 0.010
Polymer Boric Anhydride (B2O3) 1303-86-2 0.003 0.550 0.001
Silica -amorphous- 7631-86-9 0.012 2.050 0.003
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.014 2.260 0.004
Copper alloy Copper (Cu) 7440-50-8 0.139 23.190 0.036
Subtotal 0.600 100.010 0.157
Capacitor Oxide Ceramics Zirconium Dioxide (ZrO2) 1314-23-4 0.029 8.650 0.008
Silica -amorphous- 7631-86-9 0.011 3.350 0.003
Calcium Oxide (CaO) 1305-78-8 0.029 8.700 0.008
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.002 0.660 0.001
Tin solder Tin (Sn) 7440-31-5 0.007 1.990 0.002
Polymer Boric Anhydride (B2O3) 1303-86-2 0.000 0.000 0.000
Silica -amorphous- 7631-86-9 0.000 0.000 0.000
Copper alloy Copper (Cu) 7440-50-8 0.252 76.490 0.066
Subtotal 0.330 99.840 0.088
Capacitor Oxide Ceramics Barium Oxide (BaO) 1304-28-5 0.692 43.270 0.181
Titanium Dioxide (TiO2) 13463-67-7 0.372 23.270 0.097
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.297 18.560 0.078
Tin solder Tin (Sn) 7440-31-5 0.047 2.940 0.012
Polymer Boric Anhydride (B2O3) 1303-86-2 0.004 0.260 0.001
Silica -amorphous- 7631-86-9 0.016 0.980 0.004
Copper alloy Copper (Cu) 7440-50-8 0.172 10.720 0.045
Subtotal 1.600 100.000 0.418
Component Additive Not disclosed by Subco. - 0.077 0.350 0.020
Polymer Glass Fibrous 65997-17-3 4.851 21.950 1.268
Not disclosed by Subco. - 3.653 16.530 0.955
Not disclosed by Subco. - 4.851 21.950 1.268
Doped silicon Talc 14807-96-6 0.060 0.270 0.016
Silica -amorphous- 7631-86-9 0.060 0.270 0.016
Filler Barium Sulfate (BaSO4) 7727-43-7 1.837 8.310 0.480
C.I. Pigment Blue 15 147-14-8 0.009 0.040 0.002
Not disclosed by Subco. - 0.009 0.040 0.002
Not disclosed by Subco. - 0.119 0.540 0.031
Copper alloy Copper (Cu) 7440-50-8 6.469 29.270 1.691
Subtotal 21.995 99.520 5.749
Die Doped silicon Silver (Ag) 7440-22-4 0.026 1.160 0.007
Aluminium (Al) 7429-90-5 0.030 1.340 0.008
Gold (Au) 7440-57-5 0.125 5.650 0.033
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.027 1.230 0.007
Silicon (Si) 7440-21-3 1.829 82.390 0.478
Silicon Dioxide (SiO2) 14808-60-7 0.183 8.240 0.048
Subtotal 2.220 100.010 0.581
Die attach Additive BIS(TRIMETHYLSILYL)UREA 18297-63-7 0.634 0.230 0.166
Polymer 1,6-Hexanediol diglycidyl ether 16096-31-4 10.304 3.740 2.694
Not disclosed by Subco. - 8.871 3.220 2.319
Phenol Formaldehyde resin (generic) 9003-35-4 10.304 3.740 2.694
Pure metal Silver (Ag) 7440-22-4 245.371 89.060 64.142
Subtotal 275.484 99.990 72.015
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.720 0.012
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.004 1.800 0.001
Tin solder Tin (Sn) 7440-31-5 0.005 2.700 0.001
Polymer Cobalt (Co) 7440-48-4 0.000 0.180 0.000
Silica -amorphous- 7631-86-9 0.145 72.600 0.038
Subtotal 0.199 100.000 0.052
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.720 0.012
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.004 1.800 0.001
Tin solder Tin (Sn) 7440-31-5 0.005 2.700 0.001
Polymer Cobalt (Co) 7440-48-4 0.000 0.180 0.000
Silica -amorphous- 7631-86-9 0.145 72.600 0.038
Subtotal 0.199 100.000 0.052
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.720 0.012
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.004 1.800 0.001
Tin solder Tin (Sn) 7440-31-5 0.005 2.700 0.001
Polymer Cobalt (Co) 7440-48-4 0.000 0.180 0.000
Silica -amorphous- 7631-86-9 0.145 72.600 0.038
Subtotal 0.199 100.000 0.052
Mold Compound Pigment Carbon black 1333-86-4 0.770 1.000 0.201
Additive Phenolic resin - 1.540 2.000 0.403
Metal hydroxide - 3.850 5.000 1.006
Epoxy resin system - 5.390 7.000 1.409
Filler Silica fused 60676-86-0 57.750 75.000 15.096
Silica -amorphous- 7631-86-9 7.700 10.000 2.013
Subtotal 77.000 100.000 20.128
Resistor Oxide Ceramics Aluminium Trioxide (Al2O3) 1344-28-1 0.076 75.630 0.020
Silicon Dioxide (SiO2) 14808-60-7 0.002 1.510 0.001
Magnesium Oxide (MgO) 1309-48-4 0.001 1.010 0.000
N/A Not disclosed by Subco. - 0.004 3.970 0.001
Silver alloy Silver (Ag) 7440-22-4 0.008 7.650 0.002
Iron-nickel alloy Chromium (Cr) 7440-47-3 0.000 0.180 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.005 5.050 0.001
Tin solder Tin (Sn) 7440-31-5 0.004 4.380 0.001
Metallisation Palladium (Pd) 7440-05-3 0.000 0.410 0.000
Copper alloy Copper Oxide (CuO) 1317-38-0 0.000 0.210 0.000
Subtotal 0.100 100.000 0.026
Resistor Oxide Ceramics Silicon Dioxide (SiO2) 14808-60-7 0.003 1.510 0.001
Magnesium Oxide (MgO) 1309-48-4 0.002 1.010 0.001
Aluminium Trioxide (Al2O3) 1344-28-1 0.151 75.630 0.039
N/A Not disclosed by Subco. - 0.008 3.970 0.002
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.010 5.050 0.003
Chromium (Cr) 7440-47-3 0.000 0.180 0.000
Silver alloy Silver (Ag) 7440-22-4 0.015 7.650 0.004
Tin solder Tin (Sn) 7440-31-5 0.009 4.380 0.002
Metallisation Palladium (Pd) 7440-05-3 0.001 0.410 0.000
Copper alloy Copper Oxide (CuO) 1317-38-0 0.000 0.210 0.000
Subtotal 0.199 100.000 0.052
Resistor Oxide Ceramics Aluminium Trioxide (Al2O3) 1344-28-1 0.076 75.630 0.020
Magnesium Oxide (MgO) 1309-48-4 0.001 1.010 0.000
Silicon Dioxide (SiO2) 14808-60-7 0.002 1.510 0.001
N/A Not disclosed by Subco. - 0.004 3.970 0.001
Silver alloy Silver (Ag) 7440-22-4 0.008 7.650 0.002
Iron-nickel alloy Chromium (Cr) 7440-47-3 0.000 0.180 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.005 5.050 0.001
Tin solder Tin (Sn) 7440-31-5 0.004 4.380 0.001
Metallisation Palladium (Pd) 7440-05-3 0.000 0.410 0.000
Copper alloy Copper Oxide (CuO) 1317-38-0 0.000 0.210 0.000
Subtotal 0.100 100.000 0.026
Solder paste Additive Organic Acid 110-99-6 0.003 1.000 0.001
Diethylene Glycol Mono(2-ethylhexyl)ether 1559-36-0 0.014 5.000 0.004
Organic Amine 65605-36-9 0.014 5.000 0.004
Silver alloy Silver (Ag) 7440-22-4 0.014 5.000 0.004
Tin solder Tin (Sn) 7440-31-5 0.216 80.000 0.056
Polymer Poly Ethylene Glycol (PEG) 25322-68-3 0.003 1.000 0.001
Copper alloy Copper (Cu) 7440-50-8 0.008 3.000 0.002
Subtotal 0.272 100.000 0.072
Wire Additive Silicon (Si) 7440-21-3 0.001 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 0.064 99.000 0.017
Subtotal 0.065 100.000 0.017
Total 382.543 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Component
元器件
O O O O O O
Die
裸晶
O O O O O O
Die attach
贴片材料
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Solder paste
锡膏
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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