Chemical content BLM9D3438-16AM

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLM9D3438-16AM LGA-7x7-20-2 Plastic thermal enhanced package; no leads; 20 terminals; body 7.0 x 7.0 x 0.98 mm 109.209 mg
Orderable part number NC12 Effective Version Pb-free soldering Number of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLM9D3438-16AMZ 934960494515 2021-11-17 02 3 245 30 seconds 3 CN
BLM9D3438-16AMX 934960494525 2021-11-17 03 3 245 30 seconds 3 CN
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Capacitor Oxide Ceramics Barium Oxide (BaO) 1304-28-5 0.426 43.000 0.390
Titanium Dioxide (TiO2) 13463-67-7 0.213 21.500 0.195
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.026 2.580 0.024
Tin solder Tin (Sn) 7440-31-5 0.061 6.130 0.056
Polymer Boric Anhydride (B2O3) 1303-86-2 0.005 0.520 0.005
Silica -amorphous- 7631-86-9 0.021 2.080 0.019
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.022 2.260 0.020
Copper alloy Copper (Cu) 7440-50-8 0.217 21.930 0.199
Subtotal 0.991 100.000 0.908
Capacitor Oxide Ceramics Calcium Oxide (CaO) 1305-78-8 0.029 8.700 0.027
Silica -amorphous- 7631-86-9 0.011 3.350 0.010
Zirconium Dioxide (ZrO2) 1314-23-4 0.029 8.650 0.027
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.002 0.660 0.002
Tin solder Tin (Sn) 7440-31-5 0.007 1.990 0.006
Polymer Boric Anhydride (B2O3) 1303-86-2 0.001 0.160 0.001
Silica -amorphous- 7631-86-9 0.000 0.000 0.000
Copper alloy Copper (Cu) 7440-50-8 0.252 76.490 0.231
Subtotal 0.331 100.000 0.304
Capacitor Oxide Ceramics Calcium Oxide (CaO) 1305-78-8 0.057 8.700 0.052
Silica -amorphous- 7631-86-9 0.022 3.350 0.020
Zirconium Dioxide (ZrO2) 1314-23-4 0.057 8.650 0.052
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.004 0.660 0.004
Tin solder Tin (Sn) 7440-31-5 0.013 1.990 0.012
Polymer Boric Anhydride (B2O3) 1303-86-2 0.001 0.160 0.001
Silica -amorphous- 7631-86-9 0.000 0.000 0.000
Copper alloy Copper (Cu) 7440-50-8 0.505 76.490 0.462
Subtotal 0.659 100.000 0.603
Capacitor N/A Calcium Oxide (CaO) 1305-78-8 0.167 27.840 0.153
Zirconium Dioxide (ZrO2) 1314-23-4 0.209 34.820 0.191
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.017 2.870 0.016
Tin solder Tin (Sn) 7440-31-5 0.039 6.430 0.036
Polymer Boric Anhydride (B2O3) 1303-86-2 0.003 0.550 0.003
Silica -amorphous- 7631-86-9 0.012 2.050 0.011
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.014 2.260 0.013
Copper alloy Copper (Cu) 7440-50-8 0.139 23.190 0.127
Subtotal 0.600 100.010 0.550
Capacitor Oxide Ceramics Calcium Oxide (CaO) 1305-78-8 0.029 8.700 0.027
Silica -amorphous- 7631-86-9 0.011 3.350 0.010
Zirconium Dioxide (ZrO2) 1314-23-4 0.029 8.650 0.027
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.002 0.660 0.002
Tin solder Tin (Sn) 7440-31-5 0.007 1.990 0.006
Polymer Boric Anhydride (B2O3) 1303-86-2 0.000 0.000 0.000
Silica -amorphous- 7631-86-9 0.000 0.000 0.000
Copper alloy Copper (Cu) 7440-50-8 0.252 76.490 0.231
Subtotal 0.330 99.840 0.303
Capacitor Oxide Ceramics Titanium Dioxide (TiO2) 13463-67-7 0.372 23.270 0.341
Barium Oxide (BaO) 1304-28-5 0.692 43.270 0.634
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.297 18.560 0.272
Tin solder Tin (Sn) 7440-31-5 0.047 2.940 0.043
Polymer Silica -amorphous- 7631-86-9 0.016 0.980 0.015
Boric Anhydride (B2O3) 1303-86-2 0.004 0.260 0.004
Copper alloy Copper (Cu) 7440-50-8 0.172 10.720 0.157
Subtotal 1.600 100.000 1.466
Component Additive Not disclosed by Subco. - 0.077 0.350 0.071
Polymer Glass Fibrous 65997-17-3 4.807 21.950 4.402
Not disclosed by Subco. - 3.620 16.530 3.315
Not disclosed by Subco. - 4.807 21.950 4.402
Doped silicon Silica -amorphous- 7631-86-9 0.059 0.270 0.054
Filler Barium Sulfate (BaSO4) 7727-43-7 1.820 8.310 1.667
C.I. Pigment Blue 15 147-14-8 0.009 0.040 0.008
Not disclosed by Subco. - 0.118 0.540 0.108
Not disclosed by Subco. - 0.009 0.040 0.008
Talc 14807-96-6 0.164 0.750 0.150
Copper alloy Copper (Cu) 7440-50-8 6.410 29.270 5.869
Subtotal 21.900 100.000 20.054
Die Doped silicon Silver (Ag) 7440-22-4 0.034 1.510 0.031
Silicon Dioxide (SiO2) 14808-60-7 0.238 10.720 0.218
Silicon (Si) 7440-21-3 1.711 77.080 1.567
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.036 1.600 0.033
Gold (Au) 7440-57-5 0.163 7.350 0.149
Aluminium (Al) 7429-90-5 0.039 1.750 0.036
Subtotal 2.221 100.010 2.034
Die attach Silver Sinter 1,6-Hexanediol diglycidyl ether 16096-31-4 0.082 3.740 0.075
Silver (Ag) 7440-22-4 1.963 89.060 1.797
Not disclosed by Subco. - 0.071 3.220 0.065
Phenol Formaldehyde resin (generic) 9003-35-4 0.082 3.740 0.075
Not disclosed by Subco. - 0.005 0.230 0.005
Subtotal 2.203 99.990 2.017
Inductor Silver alloy Silver (Ag) 7440-22-4 0.313 78.330 0.287
Tin solder Tin (Sn) 7440-31-5 0.038 9.440 0.035
Polymer Cobalt (Co) 7440-48-4 0.024 6.110 0.022
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.024 6.110 0.022
Subtotal 0.399 99.990 0.366
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.720 0.041
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.004 1.800 0.004
Tin solder Tin (Sn) 7440-31-5 0.005 2.700 0.005
Polymer Cobalt (Co) 7440-48-4 0.000 0.180 0.000
Silica -amorphous- 7631-86-9 0.145 72.600 0.133
Subtotal 0.199 100.000 0.183
Mold Compound Pigment Carbon black 1333-86-4 0.770 1.000 0.705
Additive Metal hydroxide - 3.850 5.000 3.525
Phenolic resin - 1.540 2.000 1.410
Epoxy resin system - 5.390 7.000 4.935
Filler Silica -amorphous- 7631-86-9 7.700 10.000 7.051
Silica fused 60676-86-0 57.750 75.000 52.880
Subtotal 77.000 100.000 70.506
Resistor Oxide Ceramics Silicon Dioxide (SiO2) 14808-60-7 0.002 1.510 0.002
Magnesium Oxide (MgO) 1309-48-4 0.001 1.010 0.001
Aluminium Trioxide (Al2O3) 1344-28-1 0.076 75.630 0.070
N/A Not disclosed by Subco. - 0.004 3.970 0.004
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.005 5.050 0.005
Chromium (Cr) 7440-47-3 0.000 0.180 0.000
Silver alloy Silver (Ag) 7440-22-4 0.008 7.650 0.007
Tin solder Tin (Sn) 7440-31-5 0.004 4.380 0.004
Metallisation Palladium (Pd) 7440-05-3 0.000 0.410 0.000
Copper alloy Copper Oxide (CuO) 1317-38-0 0.000 0.210 0.000
Subtotal 0.100 100.000 0.093
Resistor Oxide Ceramics Silicon Dioxide (SiO2) 14808-60-7 0.003 1.510 0.003
Magnesium Oxide (MgO) 1309-48-4 0.002 1.010 0.002
Aluminium Trioxide (Al2O3) 1344-28-1 0.151 75.630 0.138
N/A Not disclosed by Subco. - 0.008 3.970 0.007
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.010 5.050 0.009
Chromium (Cr) 7440-47-3 0.000 0.180 0.000
Silver alloy Silver (Ag) 7440-22-4 0.015 7.650 0.014
Tin solder Tin (Sn) 7440-31-5 0.009 4.380 0.008
Metallisation Palladium (Pd) 7440-05-3 0.001 0.410 0.001
Copper alloy Copper Oxide (CuO) 1317-38-0 0.000 0.210 0.000
Subtotal 0.199 100.000 0.182
Resistor Oxide Ceramics Aluminium Trioxide (Al2O3) 1344-28-1 0.076 75.630 0.070
Magnesium Oxide (MgO) 1309-48-4 0.001 1.010 0.001
Silicon Dioxide (SiO2) 14808-60-7 0.002 1.510 0.002
N/A Not disclosed by Subco. - 0.004 3.970 0.004
Silver alloy Silver (Ag) 7440-22-4 0.008 7.650 0.007
Iron-nickel alloy Chromium (Cr) 7440-47-3 0.000 0.180 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.005 5.050 0.005
Tin solder Tin (Sn) 7440-31-5 0.004 4.380 0.004
Metallisation Palladium (Pd) 7440-05-3 0.000 0.410 0.000
Copper alloy Copper Oxide (CuO) 1317-38-0 0.000 0.210 0.000
Subtotal 0.100 100.000 0.093
Solder paste Additive Organic Amine 65605-36-9 0.014 5.000 0.013
Organic Acid 110-99-6 0.003 1.000 0.003
Diethylene Glycol Mono(2-ethylhexyl)ether 1559-36-0 0.014 5.000 0.013
Silver alloy Silver (Ag) 7440-22-4 0.014 5.000 0.013
Tin solder Tin (Sn) 7440-31-5 0.216 80.000 0.198
Polymer Poly Ethylene Glycol (PEG) 25322-68-3 0.003 1.000 0.003
Copper alloy Copper (Cu) 7440-50-8 0.008 3.000 0.007
Subtotal 0.272 100.000 0.250
Wire Additive Silicon (Si) 7440-21-3 0.001 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 0.104 99.000 0.095
Subtotal 0.105 100.000 0.096
Total 109.209 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Component
元器件
O O O O O O
Die
裸晶
O O O O O O
Die attach
贴片材料
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Solder paste
锡膏
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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