Chemical content BLM9D3336-14AM
As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.
| Type number | Package | Package description |
Total product weight |
|---|---|---|---|
| BLM9D3336-14AM | LGA-7x7-20-2 | Plastic thermal enhanced package; no leads; 20 terminals; body 7.0 x 7.0 x 0.98 mm | 109.211 mg |
| Orderable part number | NC12 | Effective | Version | Country of origin | RoHS / RHF |
|---|---|---|---|---|---|
| BLM9D3336-14AMZ | 934960493515 | 2021-11-17 | 04 | CN |
 
|
| BLM9D3336-14AMX | 934960493525 | 2021-11-17 | 03 | CN |
|
| Subpart | Material group |
Substances | CAS number | Mass (mg) | Mass (%) of subpart |
Mass (%) of total product |
|---|---|---|---|---|---|---|
| Capacitor | Oxide Ceramics | Titanium Dioxide (TiO2) | 13463-67-7 | 0.213 | 21.500 | 0.195 |
| Barium Oxide (BaO) | 1304-28-5 | 0.426 | 43.000 | 0.390 | ||
| Iron-nickel alloy | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.026 | 2.580 | 0.024 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.061 | 6.130 | 0.056 | |
| Polymer | Silica -amorphous- | 7631-86-9 | 0.021 | 2.080 | 0.019 | |
| Boric Anhydride (B2O3) | 1303-86-2 | 0.005 | 0.520 | 0.005 | ||
| Nickel solder | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.022 | 2.260 | 0.020 | |
| Copper alloy | Copper (Cu) | 7440-50-8 | 0.217 | 21.930 | 0.199 | |
| Subtotal | 0.991 | 100.000 | 0.908 | |||
| Capacitor | Oxide Ceramics | Calcium Oxide (CaO) | 1305-78-8 | 0.029 | 8.700 | 0.027 |
| Silica -amorphous- | 7631-86-9 | 0.011 | 3.350 | 0.010 | ||
| Zirconium Dioxide (ZrO2) | 1314-23-4 | 0.029 | 8.650 | 0.027 | ||
| Iron-nickel alloy | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.002 | 0.660 | 0.002 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.007 | 1.990 | 0.006 | |
| Polymer | Boric Anhydride (B2O3) | 1303-86-2 | 0.001 | 0.160 | 0.001 | |
| Silica -amorphous- | 7631-86-9 | 0.000 | 0.000 | 0.000 | ||
| Copper alloy | Copper (Cu) | 7440-50-8 | 0.252 | 76.490 | 0.231 | |
| Subtotal | 0.331 | 100.000 | 0.304 | |||
| Capacitor | Oxide Ceramics | Calcium Oxide (CaO) | 1305-78-8 | 0.057 | 8.700 | 0.052 |
| Silica -amorphous- | 7631-86-9 | 0.022 | 3.350 | 0.020 | ||
| Zirconium Dioxide (ZrO2) | 1314-23-4 | 0.057 | 8.650 | 0.052 | ||
| Iron-nickel alloy | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.004 | 0.660 | 0.004 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.013 | 1.990 | 0.012 | |
| Polymer | Boric Anhydride (B2O3) | 1303-86-2 | 0.001 | 0.160 | 0.001 | |
| Silica -amorphous- | 7631-86-9 | 0.000 | 0.000 | 0.000 | ||
| Copper alloy | Copper (Cu) | 7440-50-8 | 0.505 | 76.490 | 0.462 | |
| Subtotal | 0.659 | 100.000 | 0.603 | |||
| Capacitor | N/A | Calcium Oxide (CaO) | 1305-78-8 | 0.167 | 27.840 | 0.153 |
| Zirconium Dioxide (ZrO2) | 1314-23-4 | 0.209 | 34.820 | 0.191 | ||
| Iron-nickel alloy | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.017 | 2.870 | 0.016 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.039 | 6.430 | 0.036 | |
| Polymer | Boric Anhydride (B2O3) | 1303-86-2 | 0.003 | 0.550 | 0.003 | |
| Silica -amorphous- | 7631-86-9 | 0.012 | 2.050 | 0.011 | ||
| Nickel solder | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.014 | 2.260 | 0.013 | |
| Copper alloy | Copper (Cu) | 7440-50-8 | 0.139 | 23.190 | 0.127 | |
| Subtotal | 0.600 | 100.010 | 0.550 | |||
| Capacitor | Oxide Ceramics | Calcium Oxide (CaO) | 1305-78-8 | 0.029 | 8.700 | 0.027 |
| Silica -amorphous- | 7631-86-9 | 0.011 | 3.350 | 0.010 | ||
| Zirconium Dioxide (ZrO2) | 1314-23-4 | 0.029 | 8.650 | 0.027 | ||
| Iron-nickel alloy | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.002 | 0.660 | 0.002 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.007 | 1.990 | 0.006 | |
| Polymer | Boric Anhydride (B2O3) | 1303-86-2 | 0.000 | 0.000 | 0.000 | |
| Silica -amorphous- | 7631-86-9 | 0.000 | 0.000 | 0.000 | ||
| Copper alloy | Copper (Cu) | 7440-50-8 | 0.252 | 76.490 | 0.231 | |
| Subtotal | 0.330 | 99.840 | 0.303 | |||
| Capacitor | Oxide Ceramics | Barium Oxide (BaO) | 1304-28-5 | 0.692 | 43.270 | 0.634 |
| Titanium Dioxide (TiO2) | 13463-67-7 | 0.372 | 23.270 | 0.341 | ||
| Iron-nickel alloy | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.297 | 18.560 | 0.272 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.047 | 2.940 | 0.043 | |
| Polymer | Boric Anhydride (B2O3) | 1303-86-2 | 0.004 | 0.260 | 0.004 | |
| Silica -amorphous- | 7631-86-9 | 0.016 | 0.980 | 0.015 | ||
| Copper alloy | Copper (Cu) | 7440-50-8 | 0.172 | 10.720 | 0.157 | |
| Subtotal | 1.600 | 100.000 | 1.466 | |||
| Component | Additive | Not disclosed by Subco. | - | 0.077 | 0.350 | 0.071 |
| Polymer | Glass Fibrous | 65997-17-3 | 4.807 | 21.950 | 4.402 | |
| Not disclosed by Subco. | - | 3.620 | 16.530 | 3.315 | ||
| Not disclosed by Subco. | - | 4.807 | 21.950 | 4.402 | ||
| Doped silicon | Silica -amorphous- | 7631-86-9 | 0.059 | 0.270 | 0.054 | |
| Filler | Barium Sulfate (BaSO4) | 7727-43-7 | 1.820 | 8.310 | 1.666 | |
| C.I. Pigment Blue 15 | 147-14-8 | 0.009 | 0.040 | 0.008 | ||
| Not disclosed by Subco. | - | 0.118 | 0.540 | 0.108 | ||
| Not disclosed by Subco. | - | 0.009 | 0.040 | 0.008 | ||
| Talc | 14807-96-6 | 0.164 | 0.750 | 0.150 | ||
| Copper alloy | Copper (Cu) | 7440-50-8 | 6.410 | 29.270 | 5.869 | |
| Subtotal | 21.900 | 100.000 | 20.053 | |||
| Die | Doped silicon | Silicon Dioxide (SiO2) | 14808-60-7 | 0.238 | 10.720 | 0.218 |
| Silicon (Si) | 7440-21-3 | 1.711 | 77.080 | 1.567 | ||
| Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.036 | 1.600 | 0.033 | ||
| Gold (Au) | 7440-57-5 | 0.163 | 7.350 | 0.149 | ||
| Aluminium (Al) | 7429-90-5 | 0.039 | 1.750 | 0.036 | ||
| Silver (Ag) | 7440-22-4 | 0.034 | 1.510 | 0.031 | ||
| Subtotal | 2.221 | 100.010 | 2.034 | |||
| Die attach | Silver Sinter | Silver (Ag) | 7440-22-4 | 1.963 | 89.060 | 1.797 |
| Not disclosed by Subco. | - | 0.005 | 0.230 | 0.005 | ||
| Phenol Formaldehyde resin (generic) | 9003-35-4 | 0.082 | 3.740 | 0.075 | ||
| Not disclosed by Subco. | - | 0.071 | 3.220 | 0.065 | ||
| 1,6-Hexanediol diglycidyl ether | 16096-31-4 | 0.082 | 3.740 | 0.075 | ||
| Subtotal | 2.203 | 99.990 | 2.017 | |||
| Inductor | Silver alloy | Silver (Ag) | 7440-22-4 | 0.157 | 78.330 | 0.144 |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.019 | 9.440 | 0.017 | |
| Nickel solder | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.012 | 6.110 | 0.011 | |
| Polymer | Cobalt (Co) | 7440-48-4 | 0.012 | 6.110 | 0.011 | |
| Subtotal | 0.200 | 99.990 | 0.183 | |||
| Inductor | Silver alloy | Silver (Ag) | 7440-22-4 | 0.157 | 78.330 | 0.144 |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.019 | 9.440 | 0.017 | |
| Polymer | Cobalt (Co) | 7440-48-4 | 0.012 | 6.110 | 0.011 | |
| Nickel solder | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.012 | 6.110 | 0.011 | |
| Subtotal | 0.200 | 99.990 | 0.183 | |||
| Inductor | Silver alloy | Silver (Ag) | 7440-22-4 | 0.157 | 78.330 | 0.144 |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.019 | 9.440 | 0.017 | |
| Polymer | Cobalt (Co) | 7440-48-4 | 0.012 | 6.110 | 0.011 | |
| Nickel solder | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.012 | 6.110 | 0.011 | |
| Subtotal | 0.200 | 99.990 | 0.183 | |||
| Mold Compound | Pigment | Carbon black | 1333-86-4 | 0.770 | 1.000 | 0.705 |
| Additive | Metal hydroxide | - | 3.850 | 5.000 | 3.525 | |
| Phenolic resin | - | 1.540 | 2.000 | 1.410 | ||
| Epoxy resin system | - | 5.390 | 7.000 | 4.935 | ||
| Filler | Silica -amorphous- | 7631-86-9 | 7.700 | 10.000 | 7.051 | |
| Silica fused | 60676-86-0 | 57.750 | 75.000 | 52.879 | ||
| Subtotal | 77.000 | 100.000 | 70.505 | |||
| Resistor | Oxide Ceramics | Aluminium Trioxide (Al2O3) | 1344-28-1 | 0.076 | 75.630 | 0.070 |
| Magnesium Oxide (MgO) | 1309-48-4 | 0.001 | 1.010 | 0.001 | ||
| Silicon Dioxide (SiO2) | 14808-60-7 | 0.002 | 1.510 | 0.002 | ||
| N/A | Not disclosed by Subco. | - | 0.004 | 3.970 | 0.004 | |
| Iron-nickel alloy | Chromium (Cr) | 7440-47-3 | 0.000 | 0.180 | 0.000 | |
| Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.005 | 5.050 | 0.005 | ||
| Silver alloy | Silver (Ag) | 7440-22-4 | 0.008 | 7.650 | 0.007 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.004 | 4.380 | 0.004 | |
| Metallisation | Palladium (Pd) | 7440-05-3 | 0.000 | 0.410 | 0.000 | |
| Copper alloy | Copper Oxide (CuO) | 1317-38-0 | 0.000 | 0.210 | 0.000 | |
| Subtotal | 0.100 | 100.000 | 0.093 | |||
| Resistor | Oxide Ceramics | Silicon Dioxide (SiO2) | 14808-60-7 | 0.003 | 1.510 | 0.003 |
| Magnesium Oxide (MgO) | 1309-48-4 | 0.002 | 1.010 | 0.002 | ||
| Aluminium Trioxide (Al2O3) | 1344-28-1 | 0.151 | 75.630 | 0.138 | ||
| N/A | Not disclosed by Subco. | - | 0.008 | 3.970 | 0.007 | |
| Iron-nickel alloy | Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.010 | 5.050 | 0.009 | |
| Chromium (Cr) | 7440-47-3 | 0.000 | 0.180 | 0.000 | ||
| Silver alloy | Silver (Ag) | 7440-22-4 | 0.015 | 7.650 | 0.014 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.009 | 4.380 | 0.008 | |
| Metallisation | Palladium (Pd) | 7440-05-3 | 0.001 | 0.410 | 0.001 | |
| Copper alloy | Copper Oxide (CuO) | 1317-38-0 | 0.000 | 0.210 | 0.000 | |
| Subtotal | 0.199 | 100.000 | 0.182 | |||
| Resistor | Oxide Ceramics | Aluminium Trioxide (Al2O3) | 1344-28-1 | 0.076 | 75.630 | 0.070 |
| Magnesium Oxide (MgO) | 1309-48-4 | 0.001 | 1.010 | 0.001 | ||
| Silicon Dioxide (SiO2) | 14808-60-7 | 0.002 | 1.510 | 0.002 | ||
| N/A | Not disclosed by Subco. | - | 0.004 | 3.970 | 0.004 | |
| Silver alloy | Silver (Ag) | 7440-22-4 | 0.008 | 7.650 | 0.007 | |
| Iron-nickel alloy | Chromium (Cr) | 7440-47-3 | 0.000 | 0.180 | 0.000 | |
| Nickel (Ni) - cas no. 7440-02-0 | 7440-02-0 | 0.005 | 5.050 | 0.005 | ||
| Tin solder | Tin (Sn) | 7440-31-5 | 0.004 | 4.380 | 0.004 | |
| Metallisation | Palladium (Pd) | 7440-05-3 | 0.000 | 0.410 | 0.000 | |
| Copper alloy | Copper Oxide (CuO) | 1317-38-0 | 0.000 | 0.210 | 0.000 | |
| Subtotal | 0.100 | 100.000 | 0.093 | |||
| Solder paste | Additive | Organic Acid | 110-99-6 | 0.003 | 1.000 | 0.003 |
| Organic Amine | 65605-36-9 | 0.014 | 5.000 | 0.013 | ||
| Diethylene Glycol Mono(2-ethylhexyl)ether | 1559-36-0 | 0.014 | 5.000 | 0.013 | ||
| Silver alloy | Silver (Ag) | 7440-22-4 | 0.014 | 5.000 | 0.013 | |
| Tin solder | Tin (Sn) | 7440-31-5 | 0.216 | 80.000 | 0.198 | |
| Polymer | Poly Ethylene Glycol (PEG) | 25322-68-3 | 0.003 | 1.000 | 0.003 | |
| Copper alloy | Copper (Cu) | 7440-50-8 | 0.008 | 3.000 | 0.007 | |
| Subtotal | 0.272 | 100.000 | 0.250 | |||
| Wire | Additive | Silicon (Si) | 7440-21-3 | 0.001 | 1.000 | 0.001 |
| Pure metal | Aluminium (Al) | 7429-90-5 | 0.104 | 99.000 | 0.095 | |
| Subtotal | 0.105 | 100.000 | 0.096 | |||
| Total | 109.211 | 100.0 | 100.0 | |||
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| Name of the part 部件名称 |
铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | >多溴联苯(PBB) | 多溴二苯醚(PBDE) |
|---|---|---|---|---|---|---|
| Capacitor 电容 |
O | O | O | O | O | O |
| Capacitor 电容 |
O | O | O | O | O | O |
| Capacitor 电容 |
O | O | O | O | O | O |
| Capacitor 电容 |
O | O | O | O | O | O |
| Capacitor 电容 |
O | O | O | O | O | O |
| Capacitor 电容 |
O | O | O | O | O | O |
| Component 元器件 |
O | O | O | O | O | O |
| Die 裸晶 |
O | O | O | O | O | O |
| Die attach 贴片材料 |
O | O | O | O | O | O |
| Inductor 电感器 |
O | O | O | O | O | O |
| Inductor 电感器 |
O | O | O | O | O | O |
| Inductor 电感器 |
O | O | O | O | O | O |
| Mold Compound 注塑胶料 |
O | O | O | O | O | O |
| Resistor 电阻器 |
O | O | O | O | O | O |
| Resistor 电阻器 |
O | O | O | O | O | O |
| Resistor 电阻器 |
O | O | O | O | O | O |
| Solder paste 锡膏 |
O | O | O | O | O | O |
| Wire 线 |
O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years. |
| Disclaimer 免责声明 |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，埃赋隆 不对该等信息的精确性和完整性给予任何陈述和保证，且埃赋隆不对使用该等信息造成的后果承担责任。埃赋隆可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 |