Chemical content BLM9D0708-05AM

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Type number Package Package
description
Total product
weight
BLM9D0708-05AM LGA-7x7-20-2 Plastic thermal enhanced package; no leads; 20 terminals; body 7.0 x 7.0 x 0.98 mm 106.125 mg
Orderable part number NC12 Effective Version Pb-free soldering Number of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLM9D0708-05AMZ 934960332515 2020-12-18 02 3 245 30 seconds 3 CN
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Capacitor Outer electrode Copper (Cu) 7440-50-8 0.072 21.820 0.068
Ceramic element Boric Anhydride (B2O3) 1303-86-2 0.002 0.610 0.002
Calcium Oxide (CaO) 1305-78-8 0.086 26.060 0.081
Not disclosed by Subco. - 0.021 6.360 0.020
Silica -amorphous- 7631-86-9 0.006 1.820 0.006
Zirconium Dioxide (ZrO2) 1314-23-4 0.107 32.420 0.101
Inner Electrode Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 2.730 0.008
Plating 2 Tin (Sn) 7440-31-5 0.020 6.060 0.019
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.007 2.120 0.007
Subtotal 0.330 100.000 0.312
Capacitor Outer electrode Copper (Cu) 7440-50-8 0.072 21.820 0.068
Ceramic element Zirconium Dioxide (ZrO2) 1314-23-4 0.107 32.420 0.101
Silica -amorphous- 7631-86-9 0.006 1.820 0.006
Not disclosed by Subco. - 0.021 6.360 0.020
Calcium Oxide (CaO) 1305-78-8 0.086 26.060 0.081
Boric Anhydride (B2O3) 1303-86-2 0.002 0.610 0.002
Inner Electrode Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 2.730 0.008
Plating 2 Tin (Sn) 7440-31-5 0.020 6.060 0.019
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.007 2.120 0.007
Subtotal 0.330 100.000 0.312
Capacitor Oxide Ceramics Boric Anhydride (B2O3) 1303-86-2 0.003 0.520 0.003
Calcium Oxide (CaO) 1305-78-8 0.184 27.840 0.173
Zirconium Dioxide (ZrO2) 1314-23-4 0.230 34.790 0.217
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.019 2.900 0.018
Tin solder Tin (Sn) 7440-31-5 0.043 6.440 0.041
Polymer Silica -amorphous- 7631-86-9 0.014 2.080 0.013
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.015 2.250 0.014
Copper alloy Copper (Cu) 7440-50-8 0.153 23.180 0.144
Subtotal 0.661 100.000 0.623
Capacitor Oxide Ceramics Barium Oxide (BaO) 1304-28-5 0.284 43.000 0.268
Titanium Dioxide (TiO2) 13463-67-7 0.142 21.500 0.134
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.017 2.580 0.016
Tin solder Tin (Sn) 7440-31-5 0.040 6.130 0.038
Polymer Boric Anhydride (B2O3) 1303-86-2 0.003 0.520 0.003
Silica -amorphous- 7631-86-9 0.014 2.080 0.013
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.015 2.260 0.014
Copper alloy Copper (Cu) 7440-50-8 0.145 21.930 0.137
Subtotal 0.660 100.000 0.623
Capacitor Outer electrode Copper (Cu) 7440-50-8 0.144 21.820 0.136
Ceramic element Silica -amorphous- 7631-86-9 0.012 1.820 0.011
Zirconium Dioxide (ZrO2) 1314-23-4 0.214 32.420 0.202
Not disclosed by Subco. - 0.042 6.360 0.040
Calcium Oxide (CaO) 1305-78-8 0.172 26.060 0.162
Boric Anhydride (B2O3) 1303-86-2 0.004 0.610 0.004
Inner Electrode Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.018 2.730 0.017
Plating 2 Tin (Sn) 7440-31-5 0.040 6.060 0.038
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.014 2.120 0.013
Subtotal 0.660 100.000 0.623
Capacitor Oxide Ceramics Calcium Oxide (CaO) 1305-78-8 0.092 27.790 0.087
Zirconium Dioxide (ZrO2) 1314-23-4 0.092 27.790 0.087
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.008 2.280 0.008
Tin alloy Tin (Sn) 7440-31-5 0.021 6.490 0.020
Polymer Boric Anhydride (B2O3) 1303-86-2 0.002 0.570 0.002
Silica -amorphous- 7631-86-9 0.023 6.950 0.022
Silica -amorphous- 7631-86-9 0.007 2.050 0.007
Copper alloy Copper (Cu) 7440-50-8 0.086 26.080 0.081
Subtotal 0.331 100.000 0.314
Capacitor Outer electrode Copper (Cu) 7440-50-8 0.072 21.820 0.068
Ceramic element Zirconium Dioxide (ZrO2) 1314-23-4 0.107 32.420 0.101
Silica -amorphous- 7631-86-9 0.006 1.820 0.006
Not disclosed by Subco. - 0.021 6.360 0.020
Calcium Oxide (CaO) 1305-78-8 0.086 26.060 0.081
Boric Anhydride (B2O3) 1303-86-2 0.002 0.610 0.002
Inner Electrode Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 2.730 0.008
Plating 2 Tin (Sn) 7440-31-5 0.020 6.060 0.019
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.007 2.120 0.007
Subtotal 0.330 100.000 0.312
Capacitor N/A Zirconium Dioxide (ZrO2) 1314-23-4 0.115 34.820 0.108
Calcium Oxide (CaO) 1305-78-8 0.092 27.840 0.087
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 2.870 0.008
Tin solder Tin (Sn) 7440-31-5 0.021 6.430 0.020
Polymer Silica -amorphous- 7631-86-9 0.007 2.050 0.007
Boric Anhydride (B2O3) 1303-86-2 0.002 0.550 0.002
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.007 2.260 0.007
Copper alloy Copper (Cu) 7440-50-8 0.077 23.190 0.073
Subtotal 0.330 100.010 0.312
Capacitor Outer electrode Copper (Cu) 7440-50-8 0.072 21.820 0.068
Ceramic element Boric Anhydride (B2O3) 1303-86-2 0.002 0.610 0.002
Calcium Oxide (CaO) 1305-78-8 0.086 26.060 0.081
Zirconium Dioxide (ZrO2) 1314-23-4 0.107 32.420 0.101
Silica -amorphous- 7631-86-9 0.006 1.820 0.006
Not disclosed by Subco. - 0.021 6.360 0.020
Inner Electrode Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 2.730 0.008
Plating 2 Tin (Sn) 7440-31-5 0.020 6.060 0.019
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.007 2.120 0.007
Subtotal 0.330 100.000 0.312
Capacitor Oxide Ceramics Zirconium Dioxide (ZrO2) 1314-23-4 0.115 34.790 0.108
Calcium Oxide (CaO) 1305-78-8 0.092 27.840 0.087
Boric Anhydride (B2O3) 1303-86-2 0.002 0.520 0.002
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.010 2.900 0.009
Tin solder Tin (Sn) 7440-31-5 0.021 6.440 0.020
Polymer Silica -amorphous- 7631-86-9 0.007 2.080 0.007
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.007 2.250 0.007
Copper alloy Copper (Cu) 7440-50-8 0.076 23.180 0.072
Subtotal 0.330 100.000 0.312
Component Additive Not disclosed by Subco. - 0.056 0.290 0.053
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.979 10.210 1.865
Gold alloy Gold (Au) 7440-57-5 0.581 3.000 0.547
Polymer Not disclosed by Subco. - 2.680 13.830 2.525
Not disclosed by Subco. - 3.558 18.360 3.353
Glass Fibrous 65997-17-3 3.558 18.360 3.353
Doped silicon Silica -amorphous- 7631-86-9 0.043 0.220 0.041
Filler Not disclosed by Subco. - 0.006 0.030 0.006
C.I. Pigment Blue 15 147-14-8 0.006 0.030 0.006
Barium Sulfate (BaSO4) 7727-43-7 1.349 6.960 1.271
Not disclosed by Subco. - 0.087 0.450 0.082
Talc 14807-96-6 0.122 0.630 0.115
Pure metal Palladium (Pd) 7440-05-3 0.593 3.060 0.559
Copper alloy Copper (Cu) 7440-50-8 4.746 24.490 4.472
Subtotal 19.364 99.920 18.248
Die Doped silicon Aluminium (Al) 7429-90-5 0.007 1.750 0.007
Silver (Ag) 7440-22-4 0.006 1.510 0.006
Gold (Au) 7440-57-5 0.029 7.350 0.027
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.006 1.600 0.006
Silicon (Si) 7440-21-3 0.308 77.080 0.290
Silicon Dioxide (SiO2) 14808-60-7 0.043 10.720 0.041
Subtotal 0.399 100.010 0.377
Die attach Silver Sinter Silver (Ag) 7440-22-4 0.463 89.060 0.436
1,6-Hexanediol diglycidyl ether 16096-31-4 0.019 3.740 0.018
Not disclosed by Subco. - 0.001 0.230 0.001
Phenol Formaldehyde resin (generic) 9003-35-4 0.019 3.740 0.018
Not disclosed by Subco. - 0.017 3.220 0.016
Subtotal 0.519 99.990 0.489
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.610 0.042
Tin solder Tin (Sn) 7440-31-5 0.010 5.090 0.009
Polymer Silica -amorphous- 7631-86-9 0.063 31.410 0.059
Silica -amorphous- 7631-86-9 0.013 6.280 0.012
Silica -amorphous- 7631-86-9 0.003 1.540 0.003
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Boric Anhydride (B2O3) 1303-86-2 0.000 0.170 0.000
Aluminium Trioxide (Al2O3) 1344-28-1 0.050 25.120 0.047
Boric Anhydride (B2O3) 1303-86-2 0.001 0.510 0.001
Silica -amorphous- 7631-86-9 0.005 2.400 0.005
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 4.520 0.008
Subtotal 0.200 99.990 0.187
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.610 0.042
Tin solder Tin (Sn) 7440-31-5 0.010 5.090 0.009
Polymer Silica -amorphous- 7631-86-9 0.003 1.540 0.003
Silica -amorphous- 7631-86-9 0.013 6.280 0.012
Silica -amorphous- 7631-86-9 0.063 31.410 0.059
Boric Anhydride (B2O3) 1303-86-2 0.001 0.510 0.001
Silica -amorphous- 7631-86-9 0.005 2.400 0.005
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Boric Anhydride (B2O3) 1303-86-2 0.000 0.170 0.000
Aluminium Trioxide (Al2O3) 1344-28-1 0.050 25.120 0.047
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 4.520 0.008
Subtotal 0.200 99.990 0.187
Inductor Oxide Ceramics Silica -amorphous- 7631-86-9 0.065 8.090 0.061
Silica -amorphous- 7631-86-9 0.002 0.240 0.002
Aluminium Trioxide (Al2O3) 1344-28-1 0.518 64.740 0.488
Calcium Oxide (CaO) 1305-78-8 0.065 8.090 0.061
Impurity Oxirane, 2,2'-((1-methylethylidene)bis(4,1-phenyleneoxymethylene))bis-, homopolymer, 2-propenoate. 54847-34-6 0.038 4.740 0.036
Tin alloy Tin (Sn) 7440-31-5 0.033 4.080 0.031
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 1.180 0.008
Silver alloy Silver (Ag) 7440-22-4 0.016 1.970 0.015
Polymer Boric Anhydride (B2O3) 1303-86-2 0.000 0.030 0.000
Copper alloy Copper (Cu) 7440-50-8 0.055 6.840 0.052
Subtotal 0.801 100.000 0.754
Inductor Silver alloy Silver (Ag) 7440-22-4 0.050 22.610 0.047
Tin solder Tin (Sn) 7440-31-5 0.011 5.090 0.010
Polymer Aluminium Trioxide (Al2O3) 1344-28-1 0.055 25.120 0.052
Boric Anhydride (B2O3) 1303-86-2 0.000 0.170 0.000
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Silica -amorphous- 7631-86-9 0.005 2.400 0.005
Boric Anhydride (B2O3) 1303-86-2 0.001 0.510 0.001
Silica -amorphous- 7631-86-9 0.069 31.410 0.065
Silica -amorphous- 7631-86-9 0.014 6.280 0.013
Silica -amorphous- 7631-86-9 0.003 1.540 0.003
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.010 4.520 0.009
Subtotal 0.219 99.990 0.206
Inductor Oxide Ceramics Aluminium Trioxide (Al2O3) 1344-28-1 0.518 64.740 0.488
Calcium Oxide (CaO) 1305-78-8 0.065 8.090 0.061
Silica -amorphous- 7631-86-9 0.002 0.240 0.002
Silica -amorphous- 7631-86-9 0.065 8.090 0.061
Impurity Oxirane, 2,2'-((1-methylethylidene)bis(4,1-phenyleneoxymethylene))bis-, homopolymer, 2-propenoate. 54847-34-6 0.038 4.740 0.036
Silver alloy Silver (Ag) 7440-22-4 0.016 1.970 0.015
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 1.180 0.008
Tin alloy Tin (Sn) 7440-31-5 0.033 4.080 0.031
Polymer Boric Anhydride (B2O3) 1303-86-2 0.000 0.030 0.000
Copper alloy Copper (Cu) 7440-50-8 0.055 6.840 0.052
Subtotal 0.801 100.000 0.754
Inductor Silver alloy Silver (Ag) 7440-22-4 0.050 22.610 0.047
Tin solder Tin (Sn) 7440-31-5 0.011 5.090 0.010
Polymer Aluminium Trioxide (Al2O3) 1344-28-1 0.055 25.120 0.052
Boric Anhydride (B2O3) 1303-86-2 0.000 0.170 0.000
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Silica -amorphous- 7631-86-9 0.005 2.400 0.005
Boric Anhydride (B2O3) 1303-86-2 0.001 0.510 0.001
Silica -amorphous- 7631-86-9 0.069 31.410 0.065
Silica -amorphous- 7631-86-9 0.014 6.280 0.013
Silica -amorphous- 7631-86-9 0.003 1.540 0.003
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.010 4.520 0.009
Subtotal 0.219 99.990 0.206
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.610 0.042
Tin solder Tin (Sn) 7440-31-5 0.010 5.090 0.009
Polymer Aluminium Trioxide (Al2O3) 1344-28-1 0.050 25.120 0.047
Boric Anhydride (B2O3) 1303-86-2 0.000 0.170 0.000
Silica -amorphous- 7631-86-9 0.003 1.540 0.003
Silica -amorphous- 7631-86-9 0.013 6.280 0.012
Silica -amorphous- 7631-86-9 0.063 31.410 0.059
Boric Anhydride (B2O3) 1303-86-2 0.001 0.510 0.001
Silica -amorphous- 7631-86-9 0.005 2.400 0.005
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 4.520 0.008
Subtotal 0.200 99.990 0.187
Inductor Silver alloy Silver (Ag) 7440-22-4 0.099 22.610 0.093
Tin solder Tin (Sn) 7440-31-5 0.022 5.090 0.021
Polymer Aluminium Trioxide (Al2O3) 1344-28-1 0.111 25.120 0.105
Silica -amorphous- 7631-86-9 0.011 2.400 0.010
Boric Anhydride (B2O3) 1303-86-2 0.002 0.510 0.002
Boric Anhydride (B2O3) 1303-86-2 0.001 0.170 0.001
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Silica -amorphous- 7631-86-9 0.138 31.410 0.130
Silica -amorphous- 7631-86-9 0.028 6.280 0.026
Silica -amorphous- 7631-86-9 0.007 1.540 0.007
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.020 4.520 0.019
Subtotal 0.440 99.990 0.415
Inductor Silver alloy Silver (Ag) 7440-22-4 0.050 22.610 0.047
Tin solder Tin (Sn) 7440-31-5 0.011 5.090 0.010
Polymer Aluminium Trioxide (Al2O3) 1344-28-1 0.055 25.120 0.052
Boric Anhydride (B2O3) 1303-86-2 0.000 0.170 0.000
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Silica -amorphous- 7631-86-9 0.005 2.400 0.005
Silica -amorphous- 7631-86-9 0.003 1.540 0.003
Silica -amorphous- 7631-86-9 0.014 6.280 0.013
Silica -amorphous- 7631-86-9 0.069 31.410 0.065
Boric Anhydride (B2O3) 1303-86-2 0.001 0.510 0.001
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.010 4.520 0.009
Subtotal 0.219 99.990 0.206
Inductor Silver alloy Silver (Ag) 7440-22-4 0.045 22.610 0.042
Tin solder Tin (Sn) 7440-31-5 0.010 5.090 0.009
Polymer Silica -amorphous- 7631-86-9 0.003 1.540 0.003
Silica -amorphous- 7631-86-9 0.013 6.280 0.012
Silica -amorphous- 7631-86-9 0.063 31.410 0.059
Boric Anhydride (B2O3) 1303-86-2 0.001 0.510 0.001
Silica -amorphous- 7631-86-9 0.005 2.400 0.005
C.I. Pigment Blue 28 1345-16-0 0.001 0.340 0.001
Boric Anhydride (B2O3) 1303-86-2 0.000 0.170 0.000
Aluminium Trioxide (Al2O3) 1344-28-1 0.050 25.120 0.047
Nickel solder Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.009 4.520 0.008
Subtotal 0.200 99.990 0.187
Mold Compound Pigment Carbon black 1333-86-4 0.770 1.000 0.726
Additive Epoxy resin system - 5.390 7.000 5.079
Metal hydroxide - 3.850 5.000 3.628
Phenolic resin - 1.540 2.000 1.451
Filler Silica fused 60676-86-0 57.750 75.000 54.417
Silica -amorphous- 7631-86-9 7.700 10.000 7.256
Subtotal 77.000 100.000 72.557
Resistor Top/Bottom Conductor Silver (Ag) 7440-22-4 0.011 7.590 0.010
Copper Oxide (CuO) 1317-38-0 0.000 0.000 0.000
Coating material Not disclosed by Subco. - 0.006 4.140 0.006
Ceramic element Aluminium Trioxide (Al2O3) 1344-28-1 0.110 75.860 0.104
Magnesium Oxide (MgO) 1309-48-4 0.002 1.380 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.002 1.380 0.002
Terminal Conductor Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.001 0.690 0.001
Resistive layer Palladium (Pd) 7440-05-3 0.001 0.690 0.001
Plating 2 Tin (Sn) 7440-31-5 0.006 4.140 0.006
Terminal conductor Chromium (Cr) 7440-47-3 0.000 0.000 0.000
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.006 4.140 0.006
Subtotal 0.145 100.010 0.138
Resistor Top/Bottom Conductor Copper Oxide (CuO) 1317-38-0 0.000 0.000 0.000
Silver (Ag) 7440-22-4 0.011 7.590 0.010
Coating material Not disclosed by Subco. - 0.006 4.140 0.006
Ceramic element Magnesium Oxide (MgO) 1309-48-4 0.002 1.380 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.002 1.380 0.002
Aluminium Trioxide (Al2O3) 1344-28-1 0.110 75.860 0.104
Terminal Conductor Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.001 0.690 0.001
Plating 2 Tin (Sn) 7440-31-5 0.006 4.140 0.006
Resistive layer Palladium (Pd) 7440-05-3 0.001 0.690 0.001
Terminal conductor Chromium (Cr) 7440-47-3 0.000 0.000 0.000
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.006 4.140 0.006
Subtotal 0.145 100.010 0.138
Resistor Top/Bottom Conductor Copper Oxide (CuO) 1317-38-0 0.000 0.000 0.000
Silver (Ag) 7440-22-4 0.011 7.590 0.010
Coating material Not disclosed by Subco. - 0.006 4.140 0.006
Ceramic element Magnesium Oxide (MgO) 1309-48-4 0.002 1.380 0.002
Aluminium Trioxide (Al2O3) 1344-28-1 0.110 75.860 0.104
Silicon Dioxide (SiO2) 14808-60-7 0.002 1.380 0.002
Terminal Conductor Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.001 0.690 0.001
Plating 2 Tin (Sn) 7440-31-5 0.006 4.140 0.006
Resistive layer Palladium (Pd) 7440-05-3 0.001 0.690 0.001
Terminal conductor Chromium (Cr) 7440-47-3 0.000 0.000 0.000
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.006 4.140 0.006
Subtotal 0.145 100.010 0.138
Resistor Top/Bottom Conductor Copper Oxide (CuO) 1317-38-0 0.000 0.000 0.000
Silver (Ag) 7440-22-4 0.011 7.590 0.010
Coating material Not disclosed by Subco. - 0.006 4.140 0.006
Ceramic element Magnesium Oxide (MgO) 1309-48-4 0.002 1.380 0.002
Aluminium Trioxide (Al2O3) 1344-28-1 0.110 75.860 0.104
Silicon Dioxide (SiO2) 14808-60-7 0.002 1.380 0.002
Terminal Conductor Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.001 0.690 0.001
Plating 2 Tin (Sn) 7440-31-5 0.006 4.140 0.006
Resistive layer Palladium (Pd) 7440-05-3 0.001 0.690 0.001
Terminal conductor Chromium (Cr) 7440-47-3 0.000 0.000 0.000
Plating 1 Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.006 4.140 0.006
Subtotal 0.145 100.010 0.138
Resistor Oxide Ceramics Silicon Dioxide (SiO2) 14808-60-7 0.002 1.510 0.002
Magnesium Oxide (MgO) 1309-48-4 0.001 1.010 0.001
Aluminium Trioxide (Al2O3) 1344-28-1 0.106 75.630 0.100
Impurity Not disclosed by Subco. - 0.006 3.970 0.006
Iron-nickel alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.007 5.050 0.007
Chromium (Cr) 7440-47-3 0.000 0.180 0.000
Silver alloy Silver (Ag) 7440-22-4 0.011 7.650 0.010
Tin solder Tin (Sn) 7440-31-5 0.006 4.380 0.006
Metallisation Palladium (Pd) 7440-05-3 0.001 0.410 0.001
Copper alloy Copper Oxide (CuO) 1317-38-0 0.000 0.210 0.000
Subtotal 0.140 100.000 0.133
Solder paste Additive Diethylene Glycol Mono(2-ethylhexyl)ether 1559-36-0 0.014 5.000 0.013
Organic Acid 110-99-6 0.003 1.000 0.003
Organic Amine 65605-36-9 0.014 5.000 0.013
Silver alloy Silver (Ag) 7440-22-4 0.014 5.000 0.013
Tin solder Tin (Sn) 7440-31-5 0.216 80.000 0.204
Polymer Poly Ethylene Glycol (PEG) 25322-68-3 0.003 1.000 0.003
Copper alloy Copper (Cu) 7440-50-8 0.008 3.000 0.008
Subtotal 0.272 100.000 0.257
Wire Additive Silicon (Si) 7440-21-3 0.001 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 0.059 99.000 0.056
Subtotal 0.060 100.000 0.057
Total 106.125 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Capacitor
电容
O O O O O O
Component
元器件
O O O O O O
Die
裸晶
O O O O O O
Die attach
贴片材料
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Inductor
电感器
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Resistor
电阻器
O O O O O O
Solder paste
锡膏
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,埃赋隆 不对该等信息的精确性和完整性给予任何陈述和保证,且埃赋隆不对使用该等信息造成的后果承担责任。埃赋隆可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。