Chemical content BLC10G27XS-551AVT

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Type number Package outline Package
description
Total product
weight
BLC10G27XS-551AVT SOT1258-4 Air cavity plastic earless flanged package; 6 leads 5912.520 mg
Orderable part number Ordering code (12NC) Effective Version Pb-free soldering No. of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLC10G27XS-551AVTZ 934960238517 2025-04-29 10 3 245 30 3 PH
BLC10G27XS-551AVTY 934960238518 2025-04-29 10 3 245 30 3 PH
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap N/A Not disclosed by Subco. - 15.961 2.810 0.270
Not disclosed by Subco. - 552.039 97.190 9.337
Subtotal 568.000 100.000 9.607
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.227 3.260 0.004
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.227 3.260 0.004
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.227 3.260 0.004
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.023 0.330 0.000
Doped silicon Silver (Ag) 7440-22-4 0.130 1.870 0.002
Aluminium (Al) 7429-90-5 0.159 2.280 0.003
Gold (Au) 7440-57-5 0.195 2.800 0.003
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.075 1.080 0.001
Silicon (Si) 7440-21-3 3.653 52.480 0.062
Silicon Dioxide (SiO2) 14808-60-7 0.477 6.860 0.008
Filler Silver (Ag) 7440-22-4 1.567 22.520 0.027
Subtotal 6.960 100.000 0.118
Die Doped silicon Silver (Ag) 7440-22-4 0.057 1.510 0.001
Aluminium (Al) 7429-90-5 0.066 1.750 0.001
Gold (Au) 7440-57-5 0.276 7.350 0.005
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.060 1.600 0.001
Silicon (Si) 7440-21-3 2.898 77.080 0.049
Silicon Dioxide (SiO2) 14808-60-7 0.403 10.720 0.007
Subtotal 3.760 100.010 0.064
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.129 3.230 0.002
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.129 3.230 0.002
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.129 3.230 0.002
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.013 0.320 0.000
Doped silicon Silver (Ag) 7440-22-4 0.074 1.840 0.001
Aluminium (Al) 7429-90-5 0.046 1.160 0.001
Gold (Au) 7440-57-5 0.111 2.770 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.042 1.060 0.001
Silicon Dioxide (SiO2) 14808-60-7 0.285 7.130 0.005
Silicon (Si) 7440-21-3 2.150 53.760 0.036
Filler Silver (Ag) 7440-22-4 0.891 22.270 0.015
Subtotal 3.999 100.000 0.067
Die Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.482 10.720 0.008
Silicon (Si) 7440-21-3 3.469 77.080 0.059
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.072 1.600 0.001
Gold (Au) 7440-57-5 0.331 7.350 0.006
Aluminium (Al) 7429-90-5 0.079 1.750 0.001
Silver (Ag) 7440-22-4 0.068 1.510 0.001
Subtotal 4.501 100.010 0.076
Die attach Silver Sinter Not disclosed by Subco. - 0.037 0.230 0.001
Phenol Formaldehyde resin (generic) 9003-35-4 0.606 3.740 0.010
Not disclosed by Subco. - 0.522 3.220 0.009
1,6-Hexanediol diglycidyl ether 16096-31-4 0.606 3.740 0.010
Silver (Ag) 7440-22-4 14.428 89.060 0.244
Subtotal 16.199 99.990 0.274
Header Copper alloy Iron (Fe) 7439-89-6 5.145 0.110 0.087
Phosphorous (P) 7723-14-0 1.403 0.030 0.024
Copper (Cu) 7440-50-8 4659.526 99.620 78.808
Pure metal Palladium (Pd) 7440-05-3 10.290 0.220 0.174
Gold (Au) 7440-57-5 0.468 0.010 0.008
Subtotal 4676.832 99.990 79.101
 Ring frame Polymer 2-Methoxyethanol 109-86-4 0.000 0.000 0.000
Liquid Crystal Polymer (LCP) -aromatic- 70679-92-4 84.538 13.440 1.430
Resin system - 3.837 0.610 0.065
Metallisation Gold (Au) 7440-57-5 0.000 0.000 0.000
Palladium (Pd) 7440-05-3 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.195 0.190 0.020
Copper alloy Phosphorous (P) 7723-14-0 0.818 0.130 0.014
Iron (Fe) 7439-89-6 14.090 2.240 0.238
Copper (Cu) 7440-50-8 524.523 83.390 8.871
Subtotal 629.001 100.000 10.638
Wire Additive Silicon (Si) 7440-21-3 0.033 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 3.235 99.000 0.055
Subtotal 3.268 100.000 0.056
Total 5912.520 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die attach
贴片材料
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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