Created in 2015 and headquartered in the Netherlands, Ampleon is shaped by nearly 60 years of RF Power leadership. The company envisions to advance society through innovative RF solutions based on GaN and LDMOS technologies.
Ampleon is dedicated to being the partner of choice by delivering high-quality, high-performance RF products with its world-class talent. The portfolio offers flexibility in scaling design and production for any volume and addresses applications for 5G NR infrastructure, industrial, scientific, medical, broadcast, navigation and safety radio applications.
Proven reliability, secure supply and excellent product consistency enable highest manufacturing yields for customers who benefit from Ampleon being a one-stop partner for RF power solutions. For more details, please visit www.ampleon.com.
The Back-End Technology team of Ampleon is based in Cabuyao, Philippines. You are going to be part of the team in Philippines where technologies and development engineering projects are coming together. The Philippines team is an experienced team with engaged and passionate people. This position reports to the Principal Engineer, Wirebond Back-End Technology.
To support STR and engineering evaluations in full compliance with work instructions, engineering standards and control plan set by stakeholders and deliver in a timely manner. You will also support the following activities
- Au and/or Cu ball bonding using ASM and/or K&S machine
- Development support for GaN OMP, LGA and QFN packages
- STR, Customer Samples and Prototype Builds Support
- Pre-development, Development, DRM and DoE Builds support
- Create Recipe/Programming and Set-up for Prototype and Engineering Builds (Customer Samples, DoE, Development and Qual)
- A position in an international environment with over 35 nationalities working in cross-functional teams across 16 sites
- Growth and learning opportunities to develop yourself in Ampleon
- A variety of inspiring events throughout the year, such as various development activities, sports and many more
We are looking for someone who has the following background and capabilities:
- Graduate with a Bachelor’s degree in Engineering or an equivalent Engineering/ Technical course
- Must have at least four (4) years of experience in semiconductor manufacturing
- With experience in Copper Wirebond
- With knowledge on the following:
- Packages and Technology: GaN and LDMOS in Over Mold Package, QFN and LGA
- Different measuring equipment and Plasma machine
- Basic RCA methodology such as DMAIC, Why-why analysis
Apply for this job
To streamline the application process, please submit a detailed resume/CV, including your personal contact information, references, and a letter outlining your motivation.
Recruitment process
We prioritize efficiency, ensuring that our application process is fast, effective and straightforward. For questions or open applications, contact our recruitment team.
After submitting your application, you will receive a confirmation e-mail.
Should you be a potential fit, we will invite you for an interview.
Meet our regional HR Business Partner to establish mutual understanding and collect essential information.
Get to know the Ampleon hiring team personally, either through face-to-face interactions or online meetings. You will be invited to 3 to 6 interviews, involving these key parties: 1) hiring managers, 2) peers, and 3) HR representatives.
Once negotiations reach a satisfactory conclusion for all parties involved, you will receive a contract offer, marking the beginning of your career journey at Ampleon.
You will benefit from comprehensive onboarding, supported by information, events, and continuous assistance from your supervisor and a buddy, ensuring your comfort from day one.