Chemical content BLP9H10S-850AVT

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLP9H10S-850AVT OMP-1230-6F-1 Overmolded plastic earless flanged package; 6 leads 6030.627 mg
Orderable part number NC12 Effective Version Country of origin RoHS / RHF
BLP9H10S-850AVTZ 934960480517 2022-05-20 05 PH
BLP9H10S-850AVTY 934960480518 2022-05-20 05 PH
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.433 10.720 0.007
Silicon (Si) 7440-21-3 3.114 77.080 0.052
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.065 1.600 0.001
Gold (Au) 7440-57-5 0.297 7.350 0.005
Aluminium (Al) 7429-90-5 0.071 1.750 0.001
Silver (Ag) 7440-22-4 0.061 1.510 0.001
Subtotal 4.041 100.010 0.067
Die Doped silicon Gold (Au) 7440-57-5 0.338 7.350 0.006
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.074 1.600 0.001
Aluminium (Al) 7429-90-5 0.081 1.750 0.001
Silver (Ag) 7440-22-4 0.069 1.510 0.001
Silicon (Si) 7440-21-3 3.546 77.080 0.059
Silicon Dioxide (SiO2) 14808-60-7 0.493 10.720 0.008
Subtotal 4.601 100.010 0.076
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.291 3.230 0.005
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.291 3.230 0.005
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.291 3.230 0.005
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.029 0.320 0.000
Doped silicon Silver (Ag) 7440-22-4 0.166 1.840 0.003
Aluminium (Al) 7429-90-5 0.104 1.160 0.002
Gold (Au) 7440-57-5 0.249 2.770 0.004
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.095 1.060 0.002
Silicon (Si) 7440-21-3 4.838 53.760 0.080
Silicon Dioxide (SiO2) 14808-60-7 0.642 7.130 0.011
Filler Silver (Ag) 7440-22-4 2.004 22.270 0.033
Subtotal 9.000 100.000 0.150
Die attach Silver Sinter Silver (Ag) 7440-22-4 0.026 89.060 0.000
1,6-Hexanediol diglycidyl ether 16096-31-4 0.001 3.740 0.000
Not disclosed by Subco. - 0.001 3.220 0.000
Phenol Formaldehyde resin (generic) 9003-35-4 0.001 3.740 0.000
Not disclosed by Subco. - 0.000 0.230 0.000
Subtotal 0.029 99.990 0.000
Lead frame Pure metal layer Silver (Ag) 7440-22-4 25.262 0.720 0.419
Gold (Au) 7440-57-5 1.053 0.030 0.017
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 29.121 0.830 0.483
Palladium (Pd) 7440-05-3 4.210 0.120 0.070
Copper alloy Copper (Cu) 7440-50-8 3424.394 97.600 56.783
Iron (Fe) 7439-89-6 22.806 0.650 0.378
Phosphorous (P) 7723-14-0 0.702 0.020 0.012
Zinc (Zn) 7440-66-6 1.053 0.030 0.017
Subtotal 3508.601 100.000 58.179
Mold Compound N/A Not disclosed by Subco. - 62.500 2.500 1.036
2-[[4-(1.1-dimethylethyl)phenoxy]methyl]-oxirane 3101-60-8 150.000 6.000 2.487
Polymer Non hazardous - 50.000 2.000 0.829
Bisphenol-F/Formaldehyde/Epichlorohydrin copolymer 9003-36-5 300.000 12.000 4.975
Filler Dicyandiamide (generic) 461-58-5 15.000 0.600 0.249
Silver (Ag) 7440-22-4 1922.500 76.900 31.879
Subtotal 2500.000 100.000 41.455
Post-plating Pure metal layer Tin (Sn) 7440-31-5 0.800 99.990 0.013
Subtotal 0.800 99.990 0.013
Wire Additive Silicon (Si) 7440-21-3 0.036 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 3.519 99.000 0.058
Subtotal 3.555 100.000 0.059
Total 6030.627 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die attach
贴片材料
O O O O O O
Lead frame
引线框架
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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