Chemical content BLP9H10-30G

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLP9H10-30G SOT1483-1 TO270 529.771 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960123515 2018-07-26 3 245 30 seconds 3 221 20 seconds 3 CN,South Luzon
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Doped silicon Silver (Ag) 7440-22-4 0.012 1.460 0.002
Aluminium (Al) 7429-90-5 0.014 1.690 0.003
Gold (Au) 7440-57-5 0.033 4.030 0.006
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.013 1.550 0.002
Gold (Au) 7440-57-5 0.026 3.090 0.005
Silicon (Si) 7440-21-3 0.646 77.820 0.122
Silicon Dioxide (SiO2) 14808-60-7 0.086 10.370 0.016
Subtotal 0.830 100.010 0.156
Lead frame Copper alloy Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.360 0.100 0.068
Iron (Fe) 7439-89-6 1.404 0.390 0.265
Copper (Cu) 7440-50-8 354.528 98.480 66.921
Gold (Au) 7440-57-5 0.000 0.000 0.000
Silver (Ag) 7440-22-4 3.348 0.930 0.632
Palladium (Pd) 7440-05-3 0.036 0.010 0.007
Phosphorous (P) 7723-14-0 0.180 0.050 0.034
Zinc (Zn) 7440-66-6 0.072 0.020 0.014
Subtotal 359.928 99.980 67.941
Mold Compound Pigment Carbon black 1333-86-4 0.764 0.500 0.144
Polymer Not disclosed by Subco. - 12.220 8.000 2.307
Not disclosed by Subco. - 4.582 3.000 0.865
Filler Silica -amorphous- 7631-86-9 11.456 7.500 2.162
Silica fused 60676-86-0 123.723 81.000 23.354
Subtotal 152.745 100.000 28.832
Post-plating Pure metal Tin (Sn) 7440-31-5 12.603 100.000 2.379
Subtotal 12.603 100.000 2.379
Solder wire Lead alloy Silver (Ag) 7440-22-4 0.086 2.500 0.016
Lead (Pb) 7439-92-1 3.300 95.500 0.623
Tin (Sn) 7440-31-5 0.069 2.000 0.013
Subtotal 3.455 100.000 0.652
Wire Additive Not disclosed by Subco. - 0.000 0.003 0.000
Aluminium alloy Silicon (Si) 7440-21-3 0.002 1.150 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.000 0.006 0.000
Aluminium (Al) 7429-90-5 0.208 98.840 0.039
Subtotal 0.210 99.999 0.039
Total 529.771 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Lead frame
引线框架
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Solder wire
锡线
X O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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