Chemical content BLP2425M10S250P

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLP2425M10S250P OMP-780-4F-1 Plastic, heatsink small outline package; 4 leads (flat) 3041.407 mg
Orderable part number NC12 Effective Version Pb-free soldering Number of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLP2425M10S250PY 934960233518 2020-04-01 3 245 30 seconds 3 PH
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Doped silicon Silver (Ag) 7440-22-4 0.067 1.460 0.002
Aluminium (Al) 7429-90-5 0.077 1.690 0.003
Gold (Au) 7440-57-5 0.326 7.110 0.011
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.071 1.550 0.002
Silicon (Si) 7440-21-3 3.564 77.820 0.117
Silicon Dioxide (SiO2) 14808-60-7 0.475 10.370 0.016
Subtotal 4.580 100.000 0.151
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.113 3.330 0.004
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.113 3.330 0.004
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.011 0.330 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.113 3.330 0.004
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.151 4.450 0.005
Silicon (Si) 7440-21-3 1.838 54.060 0.060
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.037 1.100 0.001
Gold (Au) 7440-57-5 0.097 2.860 0.003
Aluminium (Al) 7429-90-5 0.079 2.330 0.003
Silver (Ag) 7440-22-4 0.065 1.900 0.002
Filler Silver (Ag) 7440-22-4 0.781 22.980 0.026
Subtotal 3.398 100.000 0.112
Die attach Lead alloy Tin (Sn) 7440-31-5 0.193 2.000 0.006
Lead (Pb) 7439-92-1 9.205 95.500 0.303
Silver (Ag) 7440-22-4 0.241 2.500 0.008
Subtotal 9.639 100.000 0.317
Lead frame Pure metal layer Gold (Au) 7440-57-5 0.193 0.010 0.006
Silver alloy Silver (Ag) 7440-22-4 3.080 0.160 0.101
Copper alloy Copper (Cu) 7440-50-8 1883.805 97.860 61.939
Iron (Fe) 7439-89-6 22.908 1.190 0.753
Phosphorous (P) 7723-14-0 0.578 0.030 0.019
Zinc (Zn) 7440-66-6 1.155 0.060 0.038
Pure metal Nickel (Ni) - cas no. 7440-02-0 7440-02-0 12.513 0.650 0.411
Palladium (Pd) 7440-05-3 0.963 0.050 0.032
Subtotal 1925.195 100.010 63.299
Mold Compound Pigment Carbon black 1333-86-4 3.225 0.300 0.106
Polymer Phenolic resin - 26.875 2.500 0.884
Epoxy Resin 115254-47-2 64.500 6.000 2.121
Filler Silica fused 60676-86-0 921.275 85.700 30.291
Silica -amorphous- 7631-86-9 59.125 5.500 1.944
Subtotal 1075.000 100.000 35.346
Post-plating Pure metal layer Tin (Sn) 7440-31-5 21.388 99.990 0.703
Subtotal 21.388 99.990 0.703
Wire Additive Silicon (Si) 7440-21-3 0.022 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 2.185 99.000 0.072
Subtotal 2.207 100.000 0.073
Total 3041.407 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die attach
贴片材料
X O O O O O
Lead frame
引线框架
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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