Chemical content BLP15H9S100

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLP15H9S100 SOT1483-1 TO270 554.053 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960250515 2020-07-22 02 3 245 30 seconds 3 221 20 seconds 3 CN
934960250538 2021-07-08 02 3 245 30 seconds 3 221 20 seconds 3 CN
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Doped silicon Silver (Ag) 7440-22-4 0.021 1.510 0.004
Aluminium (Al) 7429-90-5 0.024 1.750 0.004
Gold (Au) 7440-57-5 0.101 7.350 0.018
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.022 1.600 0.004
Silicon (Si) 7440-21-3 1.064 77.080 0.192
Silicon Dioxide (SiO2) 14808-60-7 0.148 10.720 0.027
Subtotal 1.380 100.010 0.249
Lead frame Copper alloy Silver (Ag) 7440-22-4 3.567 0.930 0.644
Gold (Au) 7440-57-5 0.000 0.000 0.000
Copper (Cu) 7440-50-8 377.671 98.480 68.165
Iron (Fe) 7439-89-6 1.496 0.390 0.270
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.384 0.100 0.069
Palladium (Pd) 7440-05-3 0.000 0.000 0.000
Phosphorous (P) 7723-14-0 0.192 0.050 0.035
Zinc (Zn) 7440-66-6 0.077 0.020 0.014
Subtotal 383.387 99.970 69.197
Mold Compound Pigment Carbon black 1333-86-4 0.764 0.500 0.138
Polymer Not disclosed by Subco. - 4.582 3.000 0.827
Not disclosed by Subco. - 12.220 8.000 2.206
Filler Silica fused 60676-86-0 123.723 81.000 22.331
Silica -amorphous- 7631-86-9 11.456 7.500 2.068
Subtotal 152.745 100.000 27.570
Post-plating Pure metal Tin (Sn) 7440-31-5 12.603 100.000 2.275
Subtotal 12.603 100.000 2.275
Solder wire Lead alloy Tin (Sn) 7440-31-5 0.069 2.000 0.012
Lead (Pb) 7439-92-1 3.300 95.500 0.596
Silver (Ag) 7440-22-4 0.086 2.500 0.016
Subtotal 3.455 100.000 0.624
Wire Additive Silicon (Si) 7440-21-3 0.005 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 0.478 99.000 0.086
Subtotal 0.483 100.000 0.087
Total 554.053 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Lead frame
引线框架
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Solder wire
锡线
X O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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