Chemical content BLM8G0710S-15PB

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLM8G0710S-15PB SOT1211-3 Plastic, heatsink small outline package; 16 leads(flat) 3005.259 mg
Orderable part number NC12 Effective Version Pb-free soldering Number of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLM8G0710S-15PBY 934960163518 2022-12-27 02 3 245 30 seconds 3 PH
BLM8G0710S-15PBYZ 934960163535 2022-12-27 03 3 245 30 seconds 3 PH
BLM8G0710S-15PBY 934960172518 2018-03-08 01 3 245 30 seconds 3 PH
BLM8G0710S-15PBYZ 934960172535 2019-02-27 02 3 245 30 seconds 3 PH
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Doped silicon Silver (Ag) 7440-22-4 0.075 0.490 0.002
Aluminium (Al) 7429-90-5 0.086 0.560 0.003
Gold (Au) 7440-57-5 0.205 1.340 0.007
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.078 0.510 0.003
Gold (Au) 7440-57-5 0.158 1.030 0.005
Silicon (Si) 7440-21-3 14.191 92.630 0.472
Silicon Dioxide (SiO2) 14808-60-7 0.529 3.450 0.018
Subtotal 15.322 100.010 0.510
Heat spreader material Pure metal Copper (Cu) 7440-50-8 1785.000 100.000 59.396
Subtotal 1785.000 100.000 59.396
Lead frame material Copper alloy Copper (Cu) 7440-50-8 277.790 97.470 9.243
Iron (Fe) 7439-89-6 6.840 2.400 0.228
Phosphorous (P) 7723-14-0 0.086 0.030 0.003
Zinc (Zn) 7440-66-6 0.285 0.100 0.009
Subtotal 285.001 100.000 9.483
Mold Compound Pigment Carbon black 1333-86-4 2.550 0.300 0.085
Polymer Phenolic resin - 21.250 2.500 0.707
Epoxy Resin 115254-47-2 51.000 6.000 1.697
Filler Silica -amorphous- 7631-86-9 46.750 5.500 1.556
Silica fused 60676-86-0 728.450 85.700 24.239
Subtotal 850.000 100.000 28.284
Post-plating Pure metal layer Tin (Sn) 7440-31-5 22.568 99.990 0.751
Subtotal 22.568 99.990 0.751
Pre-plating Pure metal Silver (Ag) 7440-22-4 3.300 100.000 0.110
Subtotal 3.300 100.000 0.110
Pre-plating Pure metal layer Gold (Au) 7440-57-5 0.013 1.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.261 97.000 0.042
Palladium (Pd) 7440-05-3 0.026 2.000 0.001
Subtotal 1.300 100.000 0.043
Solder wire Lead alloy Tin (Sn) 7440-31-5 0.849 2.000 0.028
Lead (Pb) 7439-92-1 40.551 95.500 1.349
Silver (Ag) 7440-22-4 1.062 2.500 0.035
Subtotal 42.462 100.000 1.412
Wire Additive Silicon (Si) 7440-21-3 0.003 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 0.303 99.000 0.010
Subtotal 0.306 100.000 0.010
Total 3005.259 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Heat spreader material
散热材料
O O O O O O
Lead frame material
引线框架材料
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Pre-plating
预电镀
O O O O O O
Pre-plating
预电镀
O O O O O O
Solder wire
锡线
X O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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