Chemical content BLM8D1822S-50PBG

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLM8D1822S-50PBG SOT1212-3 SOT1212-3 3012.398 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934069891518 2016-03-09 04 3 245 30 seconds 3 221 20 seconds 3 PH
934960110518 2017-10-02 01 3 245 30 seconds 3 221 20 seconds 3 PH
934960110535 2019-02-27 02 3 245 30 seconds 3 221 20 seconds 3 PH
934960125535 2019-02-27 02 3 245 30 seconds 3 221 20 seconds 3 PH
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.689 3.450 0.023
Silicon (Si) 7440-21-3 18.507 92.630 0.614
Gold (Au) 7440-57-5 0.206 1.030 0.007
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.102 0.510 0.003
Gold (Au) 7440-57-5 0.268 1.340 0.009
Aluminium (Al) 7429-90-5 0.112 0.560 0.004
Silver (Ag) 7440-22-4 0.098 0.490 0.003
Subtotal 19.982 100.010 0.663
Heat spreader material Pure metal Copper (Cu) 7440-50-8 1785.000 100.000 59.255
Subtotal 1785.000 100.000 59.255
Lead frame material Copper alloy Zinc (Zn) 7440-66-6 0.285 0.100 0.009
Phosphorous (P) 7723-14-0 0.086 0.030 0.003
Iron (Fe) 7439-89-6 6.840 2.400 0.227
Copper (Cu) 7440-50-8 277.790 97.470 9.222
Subtotal 285.001 100.000 9.461
Mold Compound Pigment Carbon black 1333-86-4 2.565 0.300 0.085
Polymer Phenolic resin - 21.375 2.500 0.710
Epoxy Resin 115254-47-2 51.300 6.000 1.703
Filler Silica fused 60676-86-0 732.735 85.700 24.324
Silica -amorphous- 7631-86-9 47.025 5.500 1.561
Subtotal 855.000 100.000 28.383
Post-plating Pure metal layer Tin (Sn) 7440-31-5 18.788 99.990 0.624
Subtotal 18.788 99.990 0.624
Pre-plating Pure metal Silver (Ag) 7440-22-4 3.300 100.000 0.110
Subtotal 3.300 100.000 0.110
Pre-plating Pure metal layer Gold (Au) 7440-57-5 0.013 1.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.261 97.000 0.042
Palladium (Pd) 7440-05-3 0.026 2.000 0.001
Subtotal 1.300 100.000 0.043
Solder wire Lead alloy Silver (Ag) 7440-22-4 1.062 2.500 0.035
Lead (Pb) 7439-92-1 40.551 95.500 1.346
Tin (Sn) 7440-31-5 0.849 2.000 0.028
Subtotal 42.462 100.000 1.409
Wire Additive Silicon (Si) 7440-21-3 0.016 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 1.549 99.000 0.051
Subtotal 1.565 100.000 0.052
Total 3012.398 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Heat spreader material
散热材料
O O O O O O
Lead frame material
引线框架材料
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Pre-plating
预电镀
O O O O O O
Pre-plating
预电镀
O O O O O O
Solder wire
锡线
X O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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