Chemical content BLC9G27XS-380AVT

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Type number Package Package
description
Total product
weight
BLC9G27XS-380AVT SOT1258-4 Air cavity plastic earless flanged package; 6 leads 5896.510 mg
Orderable part number NC12 Effective Version Country of origin RoHS / RHF
BLC9G27XS-380AVTZ 934960102517 2023-10-31 06 PH
BLC9G27XS-380AVTY 934960102518 2023-10-31 06 PH
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap N/A Not disclosed by Subco. - 15.961 2.810 0.271
Not disclosed by Subco. - 552.039 97.190 9.362
Subtotal 568.000 100.000 9.633
Die Metal oxide Silicon Dioxide (SiO2) 14808-60-7 0.211 7.330 0.004
Pure metal layer Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.126 4.380 0.002
Gold (Au) 7440-57-5 0.082 2.850 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.031 1.090 0.001
Gold (Au) 7440-57-5 0.063 2.180 0.001
Silver (Ag) 7440-22-4 0.030 1.030 0.001
Gold alloy Gold (Au) 7440-57-5 0.656 22.770 0.011
Tin (Sn) 7440-31-5 0.061 2.130 0.001
Doped silicon Silicon (Si) 7440-21-3 1.596 55.400 0.027
Front metallisation Aluminium (Al) 7429-90-5 0.035 1.200 0.001
Subtotal 2.891 100.360 0.050
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.051 3.330 0.001
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.051 3.330 0.001
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.051 3.330 0.001
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.005 0.330 0.000
Doped silicon Silver (Ag) 7440-22-4 0.029 1.900 0.000
Aluminium (Al) 7429-90-5 0.035 2.330 0.001
Gold (Au) 7440-57-5 0.043 2.850 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.017 1.100 0.000
Silicon (Si) 7440-21-3 0.833 54.780 0.014
Silicon Dioxide (SiO2) 14808-60-7 0.057 3.760 0.001
Filler Silver (Ag) 7440-22-4 0.349 22.970 0.006
Subtotal 1.521 100.010 0.026
Die Metal oxide Silicon Dioxide (SiO2) 14808-60-7 0.211 7.330 0.004
Pure metal layer Silver (Ag) 7440-22-4 0.030 1.030 0.001
Gold (Au) 7440-57-5 0.082 2.850 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.031 1.090 0.001
Gold (Au) 7440-57-5 0.063 2.180 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.126 4.380 0.002
Gold alloy Tin (Sn) 7440-31-5 0.061 2.130 0.001
Gold (Au) 7440-57-5 0.656 22.770 0.011
Doped silicon Silicon (Si) 7440-21-3 1.585 55.040 0.027
Front metallisation Aluminium (Al) 7429-90-5 0.035 1.200 0.001
Subtotal 2.880 100.000 0.050
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.203 3.380 0.003
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.203 3.380 0.003
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.203 3.380 0.003
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.020 0.340 0.000
Doped silicon Gold (Au) 7440-57-5 0.174 2.900 0.003
Aluminium (Al) 7429-90-5 0.043 0.710 0.001
Silicon Dioxide (SiO2) 14808-60-7 0.140 2.330 0.002
Silicon (Si) 7440-21-3 3.434 57.230 0.058
Silver (Ag) 7440-22-4 0.116 1.930 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.067 1.110 0.001
Filler Silver (Ag) 7440-22-4 1.399 23.320 0.024
Subtotal 6.002 100.010 0.100
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.102 4.980 0.002
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.102 4.980 0.002
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.010 0.500 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.102 4.980 0.002
Doped silicon Silver (Ag) 7440-22-4 0.029 1.420 0.000
Silicon Dioxide (SiO2) 14808-60-7 0.004 0.210 0.000
Silicon (Si) 7440-21-3 0.894 43.840 0.015
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.017 0.820 0.000
Aluminium (Al) 7429-90-5 0.035 1.740 0.001
Gold (Au) 7440-57-5 0.044 2.140 0.001
Filler Silver (Ag) 7440-22-4 0.701 34.380 0.012
Subtotal 2.040 99.990 0.035
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.132 3.230 0.002
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.132 3.230 0.002
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.013 0.320 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.132 3.230 0.002
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.291 7.130 0.005
Silicon (Si) 7440-21-3 2.193 53.760 0.037
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.043 1.060 0.001
Gold (Au) 7440-57-5 0.113 2.770 0.002
Aluminium (Al) 7429-90-5 0.047 1.160 0.001
Silver (Ag) 7440-22-4 0.075 1.840 0.001
Filler Silver (Ag) 7440-22-4 0.909 22.270 0.015
Subtotal 4.080 100.000 0.068
Header Copper alloy Phosphorous (P) 7723-14-0 1.403 0.030 0.024
Iron (Fe) 7439-89-6 5.145 0.110 0.087
Copper (Cu) 7440-50-8 4659.526 99.620 79.022
Pure metal Palladium (Pd) 7440-05-3 10.290 0.220 0.175
Gold (Au) 7440-57-5 0.468 0.010 0.008
Subtotal 4676.832 99.990 79.316
 Ring frame Polymer Resin system - 3.837 0.610 0.065
Liquid Crystal Polymer (LCP) -aromatic- 70679-92-4 84.538 13.440 1.434
2-Methoxyethanol 109-86-4 0.000 0.000 0.000
Metallisation Palladium (Pd) 7440-05-3 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.195 0.190 0.020
Gold (Au) 7440-57-5 0.000 0.000 0.000
Copper alloy Phosphorous (P) 7723-14-0 0.818 0.130 0.014
Copper (Cu) 7440-50-8 524.523 83.390 8.895
Iron (Fe) 7439-89-6 14.090 2.240 0.239
Subtotal 629.001 100.000 10.667
Wire Additive Silicon (Si) 7440-21-3 0.033 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 3.230 99.000 0.055
Subtotal 3.263 100.000 0.056
Total 5896.510 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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