Chemical content BLC9G20XS-400AVT

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Type number Package Package
description
Total product
weight
BLC9G20XS-400AVT SOT1258-4 Air cavity plastic earless flanged package; 6 leads 5924.091 mg
Orderable part number NC12 Effective Version Pb-free soldering Number of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLC9G20XS-400AVTZ 934069732517 2024-02-02 09 3 245 30 seconds 3 PH,South Luzon
BLC9G20XS-400AVTY 934069732518 2024-02-02 08 3 245 30 seconds 3 PH,South Luzon
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap N/A Not disclosed by Subco. - 15.961 2.810 0.269
Not disclosed by Subco. - 552.039 97.190 9.319
Subtotal 568.000 100.000 9.588
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.204 4.990 0.003
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.204 4.990 0.003
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.020 0.500 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.204 4.990 0.003
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.065 1.600 0.001
Silicon (Si) 7440-21-3 1.729 42.380 0.029
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.033 0.820 0.001
Gold (Au) 7440-57-5 0.087 2.140 0.001
Aluminium (Al) 7429-90-5 0.071 1.750 0.001
Silver (Ag) 7440-22-4 0.058 1.430 0.001
Filler Silver (Ag) 7440-22-4 1.404 34.420 0.024
Subtotal 4.079 100.010 0.067
Die Metal oxide Silicon Dioxide (SiO2) 14808-60-7 0.211 7.330 0.004
Pure metal layer Gold (Au) 7440-57-5 0.063 2.180 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.126 4.380 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.031 1.090 0.001
Gold (Au) 7440-57-5 0.082 2.850 0.001
Silver (Ag) 7440-22-4 0.030 1.030 0.001
Gold alloy Tin (Sn) 7440-31-5 0.061 2.130 0.001
Gold (Au) 7440-57-5 0.656 22.770 0.011
Doped silicon Silicon (Si) 7440-21-3 1.585 55.040 0.027
Front metallisation Aluminium (Al) 7429-90-5 0.035 1.200 0.001
Subtotal 2.880 100.000 0.050
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.204 4.990 0.003
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.204 4.990 0.003
Gold alloy Gold (Au) 7440-57-5 0.087 2.140 0.001
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.204 4.990 0.003
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.020 0.500 0.000
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.058 1.430 0.001
Silicon (Si) 7440-21-3 1.736 42.550 0.029
Silver (Ag) 7440-22-4 0.058 1.430 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.033 0.820 0.001
Aluminium (Al) 7429-90-5 0.071 1.750 0.001
Filler Silver (Ag) 7440-22-4 1.404 34.420 0.024
Subtotal 4.079 100.010 0.067
Die Pure metal layer Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.126 4.380 0.002
Gold (Au) 7440-57-5 0.063 2.180 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.031 1.090 0.001
Gold (Au) 7440-57-5 0.082 2.850 0.001
Silver (Ag) 7440-22-4 0.030 1.030 0.001
Metal oxide Silicon Dioxide (SiO2) 14808-60-7 0.211 7.330 0.004
Gold alloy Gold (Au) 7440-57-5 0.656 22.770 0.011
Tin (Sn) 7440-31-5 0.061 2.130 0.001
Doped silicon Silicon (Si) 7440-21-3 1.585 55.040 0.027
Front metallisation Aluminium (Al) 7429-90-5 0.035 1.200 0.001
Subtotal 2.880 100.000 0.050
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.102 4.990 0.002
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.102 4.990 0.002
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.010 0.500 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.102 4.990 0.002
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.027 1.300 0.000
Silicon (Si) 7440-21-3 0.871 42.690 0.015
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.017 0.820 0.000
Gold (Au) 7440-57-5 0.044 2.140 0.001
Aluminium (Al) 7429-90-5 0.036 1.750 0.001
Silver (Ag) 7440-22-4 0.029 1.430 0.000
Filler Silver (Ag) 7440-22-4 0.702 34.410 0.012
Subtotal 2.042 100.010 0.035
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.265 4.880 0.004
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.265 4.880 0.004
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.027 0.490 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.265 4.880 0.004
Doped silicon Gold (Au) 7440-57-5 0.114 2.090 0.002
Aluminium (Al) 7429-90-5 0.048 0.880 0.001
Silver (Ag) 7440-22-4 0.076 1.390 0.001
Silicon Dioxide (SiO2) 14808-60-7 0.293 5.390 0.005
Silicon (Si) 7440-21-3 2.211 40.640 0.037
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.044 0.800 0.001
Filler Silver (Ag) 7440-22-4 1.832 33.670 0.031
Subtotal 5.440 99.990 0.090
Header Pure metal layer Silver (Ag) 7440-22-4 0.000 0.000 0.000
Gold (Au) 7440-57-5 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 3.762 0.080 0.064
Copper alloy Copper (Cu) 7440-50-8 4692.183 99.770 79.205
Iron (Fe) 7439-89-6 4.703 0.100 0.079
Lead (Pb) 7439-92-1 0.000 0.000 0.000
Palladium (Pd) 7440-05-3 0.470 0.010 0.008
Phosphorous (P) 7723-14-0 1.411 0.030 0.024
Subtotal 4702.529 99.990 79.380
 Ring frame Polymer Resin system - 3.837 0.610 0.065
2-Methoxyethanol 109-86-4 0.000 0.000 0.000
Liquid Crystal Polymer (LCP) -aromatic- 70679-92-4 84.538 13.440 1.427
Metallisation Palladium (Pd) 7440-05-3 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.195 0.190 0.020
Gold (Au) 7440-57-5 0.000 0.000 0.000
Copper alloy Phosphorous (P) 7723-14-0 0.818 0.130 0.014
Iron (Fe) 7439-89-6 14.090 2.240 0.238
Copper (Cu) 7440-50-8 524.523 83.390 8.854
Subtotal 629.001 100.000 10.618
Substance Pigment Not disclosed by Subco. - 0.500 100.000 0.008
Subtotal 0.500 100.000 0.008
Wire Additive Silicon (Si) 7440-21-3 0.027 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 2.634 99.000 0.044
Subtotal 2.661 100.000 0.044
Total 5924.091 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Substance
材质
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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