Chemical content BLC10G22XS-603AVT

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Type number Package Package
description
Total product
weight
BLC10G22XS-603AVT SOT1258-4 DFM6 5923.549 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960516517 2021-10-07 02 3 245 30 seconds 3 221 20 seconds 3 PH
934960516518 2021-10-07 02 3 245 30 seconds 3 221 20 seconds 3 PH
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap N/A Not disclosed by Subco. - 15.961 2.810 0.269
Not disclosed by Subco. - 552.039 97.190 9.319
Subtotal 568.000 100.000 9.588
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.065 3.250 0.001
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.065 3.250 0.001
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.006 0.320 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.065 3.250 0.001
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.017 0.860 0.000
Silicon (Si) 7440-21-3 1.174 58.710 0.020
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.021 1.070 0.000
Gold (Au) 7440-57-5 0.056 2.780 0.001
Aluminium (Al) 7429-90-5 0.045 2.270 0.001
Silver (Ag) 7440-22-4 0.037 1.850 0.001
Filler Silver (Ag) 7440-22-4 0.448 22.390 0.008
Subtotal 1.999 100.000 0.034
Die Doped silicon Aluminium (Al) 7429-90-5 0.066 1.200 0.001
Gold (Au) 7440-57-5 1.523 27.800 0.026
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.300 5.470 0.005
Silicon (Si) 7440-21-3 3.016 55.040 0.051
Silicon Dioxide (SiO2) 14808-60-7 0.402 7.330 0.007
Tin (Sn) 7440-31-5 0.117 2.130 0.002
Silver (Ag) 7440-22-4 0.056 1.030 0.001
Subtotal 5.480 100.000 0.093
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.129 3.230 0.002
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.129 3.230 0.002
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.013 0.320 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.129 3.230 0.002
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.285 7.130 0.005
Silicon (Si) 7440-21-3 2.150 53.760 0.036
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.042 1.060 0.001
Gold (Au) 7440-57-5 0.111 2.770 0.002
Aluminium (Al) 7429-90-5 0.046 1.160 0.001
Silver (Ag) 7440-22-4 0.074 1.840 0.001
Filler Silver (Ag) 7440-22-4 0.891 22.270 0.015
Subtotal 3.999 100.000 0.067
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.113 3.330 0.002
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.113 3.330 0.002
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.011 0.330 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.113 3.330 0.002
Doped silicon Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.037 1.100 0.001
Silicon (Si) 7440-21-3 1.838 54.060 0.031
Silicon Dioxide (SiO2) 14808-60-7 0.151 4.450 0.003
Gold (Au) 7440-57-5 0.097 2.860 0.002
Aluminium (Al) 7429-90-5 0.079 2.330 0.001
Silver (Ag) 7440-22-4 0.065 1.900 0.001
Filler Silver (Ag) 7440-22-4 0.781 22.980 0.013
Subtotal 3.398 100.000 0.058
Die Doped silicon Tin (Sn) 7440-31-5 0.117 2.130 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.402 7.330 0.007
Silicon (Si) 7440-21-3 3.016 55.040 0.051
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.300 5.470 0.005
Gold (Au) 7440-57-5 1.523 27.800 0.026
Aluminium (Al) 7429-90-5 0.066 1.200 0.001
Silver (Ag) 7440-22-4 0.056 1.030 0.001
Subtotal 5.480 100.000 0.093
Header Pure metal layer Silver (Ag) 7440-22-4 16.931 0.360 0.286
Gold (Au) 7440-57-5 0.000 0.000 0.000
Palladium (Pd) 7440-05-3 2.352 0.050 0.040
Copper alloy Copper (Cu) 7440-50-8 4677.134 99.450 78.958
Iron (Fe) 7439-89-6 4.703 0.100 0.079
Phosphorous (P) 7723-14-0 1.411 0.030 0.024
Subtotal 4702.531 99.990 79.387
 Ring frame Polymer Liquid Crystal Polymer (LCP) -aromatic- 70679-92-4 84.538 13.440 1.427
2-Methoxyethanol 109-86-4 0.000 0.000 0.000
Resin system - 3.837 0.610 0.065
Metallisation Gold (Au) 7440-57-5 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.195 0.190 0.020
Palladium (Pd) 7440-05-3 0.000 0.000 0.000
Copper alloy Copper (Cu) 7440-50-8 524.523 83.390 8.855
Iron (Fe) 7439-89-6 14.090 2.240 0.238
Phosphorous (P) 7723-14-0 0.818 0.130 0.014
Subtotal 629.001 100.000 10.619
Wire Additive Silicon (Si) 7440-21-3 0.037 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 3.624 99.000 0.061
Subtotal 3.661 100.000 0.062
Total 5923.549 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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