Chemical content BLC10G22LS-240PVT

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLC10G22LS-240PVT SOT1275-1 DFM6 2725.040 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960067517 2017-05-09 04 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
934960067518 2017-05-09 04 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap Polymer Liquid Crystal Polymer (LCP) -natural- - 289.278 99.000 10.616
Epoxy Resin 115254-47-2 2.922 1.000 0.107
Subtotal 292.200 100.000 10.723
Die Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.090 3.570 0.003
Silicon (Si) 7440-21-3 2.227 88.380 0.082
Gold (Au) 7440-57-5 0.112 4.430 0.004
Aluminium (Al) 7429-90-5 0.091 3.620 0.003
Subtotal 2.520 100.000 0.092
Die Doped silicon Silver (Ag) 7440-22-4 0.037 1.460 0.001
Aluminium (Al) 7429-90-5 0.042 1.690 0.002
Gold (Au) 7440-57-5 0.077 3.090 0.003
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.039 1.550 0.001
Gold (Au) 7440-57-5 0.101 4.030 0.004
Silicon (Si) 7440-21-3 1.946 77.820 0.071
Silicon Dioxide (SiO2) 14808-60-7 0.259 10.370 0.010
Subtotal 2.501 100.010 0.092
Die Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.040 4.020 0.001
Silicon (Si) 7440-21-3 0.879 87.920 0.032
Gold (Au) 7440-57-5 0.044 4.440 0.002
Aluminium (Al) 7429-90-5 0.036 3.620 0.001
Subtotal 0.999 100.000 0.036
Die Doped silicon Gold (Au) 7440-57-5 0.057 1.990 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.022 0.770 0.001
Aluminium (Al) 7429-90-5 0.024 0.840 0.001
Silver (Ag) 7440-22-4 0.038 1.330 0.001
Silicon Dioxide (SiO2) 14808-60-7 0.146 5.130 0.005
Silicon (Si) 7440-21-3 2.555 89.950 0.094
Subtotal 2.842 100.010 0.104
Header Pure metal Nickel (Ni) - cas no. 7440-02-0 7440-02-0 13.013 0.650 0.478
Molybdenum (Mo) 7439-98-7 947.346 47.320 34.764
Copper (Cu) 7440-50-8 1023.823 51.140 37.571
Gold (Au) 7440-57-5 18.018 0.900 0.661
Subtotal 2002.200 100.010 73.474
 Ring frame Polymer Epoxy resin system - 5.992 1.430 0.220
Liquid Crystal Polymer (LCP) -natural- - 154.988 36.990 5.688
Pure metal Gold (Au) 7440-57-5 6.997 1.670 0.257
Cobalt (Co) 7440-48-4 2.388 0.570 0.088
Copper (Cu) 7440-50-8 238.998 57.040 8.770
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 9.595 2.290 0.352
Subtotal 418.958 99.990 15.375
Substance Pigment Not disclosed by Subco. - 0.500 100.000 0.018
Subtotal 0.500 100.000 0.018
Wire Additive Silicon (Si) 7440-21-3 0.023 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 2.297 99.000 0.084
Subtotal 2.320 100.000 0.085
Total 2725.040 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Substance
材质
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,埃赋隆 不对该等信息的精确性和完整性给予任何陈述和保证,且埃赋隆不对使用该等信息造成的后果承担责任。埃赋隆可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。