Chemical content BLC10G18XS-550AVT

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Type number Package Package
description
Total product
weight
BLC10G18XS-550AVT SOT1258-4 Air cavity plastic earless flanged package; 6 leads 5901.561 mg
Orderable part number NC12 Effective Version Country of origin RoHS / RHF
BLC10G18XS-550AVTZ 934960128517 2023-10-31 05 PH
BLC10G18XS-550AVTY 934960128518 2023-10-31 05 PH
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap N/A Not disclosed by Subco. - 15.961 2.810 0.270
Not disclosed by Subco. - 552.039 97.190 9.354
Subtotal 568.000 100.000 9.624
Die Doped silicon Gold (Au) 7440-57-5 0.806 22.770 0.014
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.155 4.380 0.003
Silicon (Si) 7440-21-3 1.948 55.040 0.033
Silicon Dioxide (SiO2) 14808-60-7 0.259 7.330 0.004
Tin (Sn) 7440-31-5 0.075 2.130 0.001
Gold (Au) 7440-57-5 0.077 2.180 0.001
Silver (Ag) 7440-22-4 0.036 1.030 0.001
Aluminium (Al) 7429-90-5 0.042 1.200 0.001
Gold (Au) 7440-57-5 0.101 2.850 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.039 1.090 0.001
Subtotal 3.538 100.000 0.061
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.065 3.330 0.001
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.065 3.330 0.001
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.006 0.330 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.065 3.330 0.001
Doped silicon Silver (Ag) 7440-22-4 0.037 1.900 0.001
Aluminium (Al) 7429-90-5 0.045 2.330 0.001
Silicon Dioxide (SiO2) 14808-60-7 0.054 2.770 0.001
Silicon (Si) 7440-21-3 1.083 55.800 0.018
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.021 1.100 0.000
Gold (Au) 7440-57-5 0.055 2.850 0.001
Filler Silver (Ag) 7440-22-4 0.445 22.950 0.008
Subtotal 1.941 100.020 0.033
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.129 3.320 0.002
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.129 3.320 0.002
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.129 3.320 0.002
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.013 0.330 0.000
Doped silicon Silver (Ag) 7440-22-4 0.074 1.900 0.001
Aluminium (Al) 7429-90-5 0.090 2.330 0.002
Gold (Au) 7440-57-5 0.111 2.850 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.089 2.290 0.002
Silicon (Si) 7440-21-3 2.184 56.290 0.037
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.043 1.100 0.001
Filler Silver (Ag) 7440-22-4 0.890 22.940 0.015
Subtotal 3.881 99.990 0.066
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.081 3.230 0.001
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.081 3.230 0.001
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.081 3.230 0.001
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.008 0.320 0.000
Doped silicon Aluminium (Al) 7429-90-5 0.029 1.160 0.000
Gold (Au) 7440-57-5 0.069 2.770 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.027 1.060 0.000
Silicon Dioxide (SiO2) 14808-60-7 0.178 7.130 0.003
Silicon (Si) 7440-21-3 1.344 53.760 0.023
Silver (Ag) 7440-22-4 0.046 1.840 0.001
Filler Silver (Ag) 7440-22-4 0.557 22.270 0.009
Subtotal 2.501 100.000 0.040
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.162 3.230 0.003
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.016 0.320 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.162 3.230 0.003
Doped silicon Silicon (Si) 7440-21-3 2.688 53.760 0.046
Silicon Dioxide (SiO2) 14808-60-7 0.357 7.130 0.006
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.053 1.060 0.001
Gold (Au) 7440-57-5 0.139 2.770 0.002
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.162 3.230 0.003
Aluminium (Al) 7429-90-5 0.058 1.160 0.001
Silver (Ag) 7440-22-4 0.092 1.840 0.002
Filler Silver (Ag) 7440-22-4 1.114 22.270 0.019
Subtotal 5.003 100.000 0.086
Die Doped silicon Silver (Ag) 7440-22-4 0.073 1.030 0.001
Aluminium (Al) 7429-90-5 0.085 1.200 0.001
Gold (Au) 7440-57-5 0.202 2.850 0.003
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.077 1.090 0.001
Gold (Au) 7440-57-5 0.154 2.180 0.003
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.310 4.380 0.005
Gold (Au) 7440-57-5 1.612 22.770 0.027
Silicon (Si) 7440-21-3 3.897 55.040 0.066
Silicon Dioxide (SiO2) 14808-60-7 0.519 7.330 0.009
Tin (Sn) 7440-31-5 0.151 2.130 0.003
Subtotal 7.080 100.000 0.119
Header Copper alloy Phosphorous (P) 7723-14-0 1.403 0.030 0.024
Iron (Fe) 7439-89-6 5.145 0.110 0.087
Copper (Cu) 7440-50-8 4659.526 99.620 78.954
Pure metal Palladium (Pd) 7440-05-3 10.290 0.220 0.174
Gold (Au) 7440-57-5 0.468 0.010 0.008
Subtotal 4676.832 99.990 79.247
 Ring frame Polymer Resin system - 3.837 0.610 0.065
2-Methoxyethanol 109-86-4 0.000 0.000 0.000
Liquid Crystal Polymer (LCP) -aromatic- 70679-92-4 84.538 13.440 1.432
Metallisation Palladium (Pd) 7440-05-3 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 1.195 0.190 0.020
Gold (Au) 7440-57-5 0.000 0.000 0.000
Copper alloy Phosphorous (P) 7723-14-0 0.818 0.130 0.014
Iron (Fe) 7439-89-6 14.090 2.240 0.239
Copper (Cu) 7440-50-8 524.523 83.390 8.888
Subtotal 629.001 100.000 10.658
Wire Additive Silicon (Si) 7440-21-3 0.038 1.000 0.001
Pure metal Aluminium (Al) 7429-90-5 3.746 99.000 0.063
Subtotal 3.784 100.000 0.064
Total 5901.561 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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