Chemical content BLC10G15XS-301AVT

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Type number Package Package
description
Total product
weight
BLC10G15XS-301AVT SOT1275-1 DFM6 2542.923 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960324517 2020-07-08 04 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
934960324518 2020-07-08 04 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
934960324535 2020-07-08 05 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap N/A Not disclosed by Subco. - 10.315 3.530 0.406
Not disclosed by Subco. - 281.885 96.470 11.085
Subtotal 292.200 100.000 11.491
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.065 3.380 0.003
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.065 3.380 0.003
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.065 3.380 0.003
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.007 0.340 0.000
Doped silicon Silver (Ag) 7440-22-4 0.037 1.930 0.001
Aluminium (Al) 7429-90-5 0.014 0.710 0.001
Gold (Au) 7440-57-5 0.055 2.890 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.021 1.110 0.001
Silicon (Si) 7440-21-3 1.120 58.350 0.044
Silicon Dioxide (SiO2) 14808-60-7 0.024 1.250 0.001
Filler Silver (Ag) 7440-22-4 0.447 23.290 0.018
Subtotal 1.920 100.010 0.077
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.081 3.230 0.003
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.081 3.230 0.003
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.008 0.320 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.081 3.230 0.003
Doped silicon Gold (Au) 7440-57-5 0.069 2.770 0.003
Aluminium (Al) 7429-90-5 0.029 1.160 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.027 1.060 0.001
Silver (Ag) 7440-22-4 0.046 1.840 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.178 7.130 0.007
Silicon (Si) 7440-21-3 1.344 53.760 0.053
Filler Silver (Ag) 7440-22-4 0.557 22.270 0.022
Subtotal 2.501 100.000 0.098
Die Doped silicon Tin (Sn) 7440-31-5 0.058 2.130 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.201 7.330 0.008
Silicon (Si) 7440-21-3 1.508 55.040 0.059
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.150 5.470 0.006
Gold (Au) 7440-57-5 0.762 27.800 0.030
Aluminium (Al) 7429-90-5 0.033 1.200 0.001
Silver (Ag) 7440-22-4 0.028 1.030 0.001
Subtotal 2.740 100.000 0.107
Die Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.201 7.330 0.008
Tin (Sn) 7440-31-5 0.058 2.130 0.002
Silicon (Si) 7440-21-3 1.508 55.040 0.059
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.150 5.470 0.006
Silver (Ag) 7440-22-4 0.028 1.030 0.001
Aluminium (Al) 7429-90-5 0.033 1.200 0.001
Gold (Au) 7440-57-5 0.762 27.800 0.030
Subtotal 2.740 100.000 0.107
Header Pure metal layer Palladium (Pd) 7440-05-3 1.275 0.070 0.050
Gold (Au) 7440-57-5 0.000 0.000 0.000
Silver (Ag) 7440-22-4 9.474 0.520 0.373
Copper alloy Phosphorous (P) 7723-14-0 0.547 0.030 0.022
Iron (Fe) 7439-89-6 1.822 0.100 0.072
Copper (Cu) 7440-50-8 1808.699 99.270 71.127
Subtotal 1821.817 99.990 71.644
 Ring frame Pure metal layer Gold (Au) 7440-57-5 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 6.117 1.460 0.241
Palladium (Pd) 7440-05-3 0.545 0.130 0.021
N/A Copper (Cu) 7440-50-8 336.499 80.310 13.233
Not disclosed by Subco. - 2.598 0.620 0.102
Not disclosed by Subco. - 73.241 17.480 2.880
Subtotal 419.000 100.000 16.477
Wire Additive Silicon (Si) 7440-21-3 0.000 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 0.005 99.000 0.000
Subtotal 0.005 100.000 0.000
Total 2542.923 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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