Chemical content BLC10G15XS-301AVT

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Type number Package Package
description
Total product
weight
BLC10G15XS-301AVT SOT1275-1 Air cavity plastic earless flanged package; 6 leads 2545.412 mg
Orderable part number NC12 Effective Version Pb-free soldering Number of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLC10G15XS-301AVTZ 934960324517 2020-07-08 08 3 245 30 seconds 3 PH
BLC10G15XS-301AVTY 934960324518 2020-07-08 08 3 245 30 seconds 3 PH
BLC10G15XS-301AVTYZ 934960324535 2020-07-08 08 3 245 30 seconds 3 PH
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap N/A Not disclosed by Subco. - 281.885 96.470 11.074
Not disclosed by Subco. - 10.315 3.530 0.405
Subtotal 292.200 100.000 11.479
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.065 3.380 0.003
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.065 3.380 0.003
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.007 0.340 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.065 3.380 0.003
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.024 1.250 0.001
Silicon (Si) 7440-21-3 1.120 58.350 0.044
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.021 1.110 0.001
Gold (Au) 7440-57-5 0.055 2.890 0.002
Aluminium (Al) 7429-90-5 0.014 0.710 0.001
Silver (Ag) 7440-22-4 0.037 1.930 0.001
Filler Silver (Ag) 7440-22-4 0.447 23.290 0.018
Subtotal 1.920 100.010 0.077
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.081 3.230 0.003
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.081 3.230 0.003
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.081 3.230 0.003
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.008 0.320 0.000
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.178 7.130 0.007
Aluminium (Al) 7429-90-5 0.029 1.160 0.001
Silver (Ag) 7440-22-4 0.046 1.840 0.002
Gold (Au) 7440-57-5 0.069 2.770 0.003
Silicon (Si) 7440-21-3 1.344 53.760 0.053
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.027 1.060 0.001
Filler Silver (Ag) 7440-22-4 0.557 22.270 0.022
Subtotal 2.501 100.000 0.098
Die Doped silicon Tin (Sn) 7440-31-5 0.058 2.130 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.201 7.330 0.008
Silicon (Si) 7440-21-3 1.508 55.040 0.059
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.150 5.470 0.006
Gold (Au) 7440-57-5 0.762 27.800 0.030
Aluminium (Al) 7429-90-5 0.033 1.200 0.001
Silver (Ag) 7440-22-4 0.028 1.030 0.001
Subtotal 2.740 100.000 0.107
Die Doped silicon Tin (Sn) 7440-31-5 0.058 2.130 0.002
Silicon Dioxide (SiO2) 14808-60-7 0.201 7.330 0.008
Silicon (Si) 7440-21-3 1.508 55.040 0.059
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.150 5.470 0.006
Gold (Au) 7440-57-5 0.762 27.800 0.030
Aluminium (Al) 7429-90-5 0.033 1.200 0.001
Silver (Ag) 7440-22-4 0.028 1.030 0.001
Subtotal 2.740 100.000 0.107
Header Pure metal Gold (Au) 7440-57-5 0.182 0.010 0.007
Palladium (Pd) 7440-05-3 6.203 0.340 0.244
Copper alloy Copper (Cu) 7440-50-8 1815.185 99.490 71.312
Iron (Fe) 7439-89-6 2.189 0.120 0.086
Phosphorous (P) 7723-14-0 0.547 0.030 0.021
Subtotal 1824.306 99.990 71.670
 Ring frame Pure metal layer Palladium (Pd) 7440-05-3 0.545 0.130 0.021
Gold (Au) 7440-57-5 0.000 0.000 0.000
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 6.117 1.460 0.240
N/A Not disclosed by Subco. - 73.241 17.480 2.877
Copper (Cu) 7440-50-8 336.499 80.310 13.220
Not disclosed by Subco. - 2.598 0.620 0.102
Subtotal 419.000 100.000 16.460
Wire Additive Silicon (Si) 7440-21-3 0.000 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 0.005 99.000 0.000
Subtotal 0.005 100.000 0.000
Total 2545.412 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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