Chemical content BLM9D2327-26B

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLM9D2327-26B SOT1462-1 PQFN20 1074.007 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960141515 2019-02-28 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.343 10.370 0.032
Silicon (Si) 7440-21-3 2.576 77.820 0.240
Gold (Au) 7440-57-5 0.102 3.090 0.009
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.051 1.550 0.005
Gold (Au) 7440-57-5 0.133 4.030 0.012
Aluminium (Al) 7429-90-5 0.056 1.690 0.005
Silver (Ag) 7440-22-4 0.048 1.460 0.004
Subtotal 3.309 100.010 0.307
Die attach Additive BIS(TRIMETHYLSILYL)UREA 18297-63-7 0.008 0.230 0.001
Polymer 1,6-Hexanediol diglycidyl ether 16096-31-4 0.138 3.740 0.013
Not disclosed by Subco. - 0.119 3.220 0.011
Phenol Formaldehyde resin (generic) 9003-35-4 0.138 3.740 0.013
Pure metal Silver (Ag) 7440-22-4 3.283 89.060 0.306
Subtotal 3.686 99.990 0.344
Lead frame Pure metal layer Silver (Ag) 7440-22-4 0.946 0.570 0.088
Copper alloy Copper (Cu) 7440-50-8 161.070 97.030 14.996
Iron (Fe) 7439-89-6 3.801 2.290 0.354
Phosphorous (P) 7723-14-0 0.017 0.010 0.002
Zinc (Zn) 7440-66-6 0.166 0.100 0.015
Subtotal 166.000 100.000 15.455
Mold Compound Pigment Carbon black 1333-86-4 0.010 1.000 0.001
Polymer Not disclosed by Subco. - 0.050 5.000 0.005
Filler Silica -amorphous- 7631-86-9 0.050 5.000 0.005
Silica fused 60676-86-0 0.840 84.000 0.078
Subtotal 0.950 95.000 0.089
Post-plating Pure metal layer Tin (Sn) 7440-31-5 899.910 99.990 83.786
Subtotal 899.910 99.990 83.786
Wire Additive Silicon (Si) 7440-21-3 0.002 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 0.150 99.000 0.014
Subtotal 0.152 100.000 0.014
Total 1074.007 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Die attach
贴片材料
O O O O O O
Lead frame
引线框架
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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