Chemical content BLM10D1822-60ABG

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLM10D1822-60ABG OMP-400-8G-1 OMP-400-8G-1 1446.976 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960232517 2019-10-11 04 3 245 30 seconds 3 221 20 seconds 3 PH
934960232535 2019-10-11 01 3 245 30 seconds 3 221 20 seconds 3 PH
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.016 3.230 0.001
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.016 3.230 0.001
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.016 3.230 0.001
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.002 0.320 0.000
Doped silicon Silver (Ag) 7440-22-4 0.009 1.840 0.001
Aluminium (Al) 7429-90-5 0.006 1.160 0.000
Gold (Au) 7440-57-5 0.014 2.770 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.005 1.060 0.000
Silicon (Si) 7440-21-3 0.263 53.760 0.018
Silicon Dioxide (SiO2) 14808-60-7 0.035 7.130 0.002
Filler Silver (Ag) 7440-22-4 0.109 22.270 0.008
Subtotal 0.491 100.000 0.033
Die Doped silicon Silver (Ag) 7440-22-4 0.066 1.510 0.005
Aluminium (Al) 7429-90-5 0.076 1.750 0.005
Gold (Au) 7440-57-5 0.320 7.350 0.022
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.070 1.600 0.005
Silicon (Si) 7440-21-3 3.353 77.080 0.232
Silicon Dioxide (SiO2) 14808-60-7 0.466 10.720 0.032
Subtotal 4.351 100.010 0.301
Die attach Additive BIS(TRIMETHYLSILYL)UREA 18297-63-7 0.020 0.230 0.001
Polymer 1,6-Hexanediol diglycidyl ether 16096-31-4 0.322 3.740 0.022
Not disclosed by Subco. - 0.277 3.220 0.019
Phenol Formaldehyde resin (generic) 9003-35-4 0.322 3.740 0.022
Pure metal Silver (Ag) 7440-22-4 7.658 89.060 0.529
Subtotal 8.599 99.990 0.593
Lead frame Pure metal layer Palladium (Pd) 7440-05-3 0.540 0.060 0.037
Silver (Ag) 7440-22-4 6.480 0.720 0.448
Gold (Au) 7440-57-5 0.180 0.020 0.012
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 3.690 0.410 0.255
Copper alloy Zinc (Zn) 7440-66-6 0.540 0.060 0.037
Phosphorous (P) 7723-14-0 0.360 0.040 0.025
Copper (Cu) 7440-50-8 876.420 97.380 60.569
Iron (Fe) 7439-89-6 11.790 1.310 0.815
Subtotal 900.000 100.000 62.198
Mold Compound N/A Not disclosed by Subco. - 13.104 2.500 0.906
2-[[4-(1.1-dimethylethyl)phenoxy]methyl]-oxirane 3101-60-8 31.450 6.000 2.173
Polymer Bisphenol-F/Formaldehyde/Epichlorohydrin copolymer 9003-36-5 62.900 12.000 4.347
Non hazardous - 10.483 2.000 0.724
Filler Silver (Ag) 7440-22-4 403.084 76.900 27.857
Dicyandiamide (generic) 461-58-5 3.145 0.600 0.217
Subtotal 524.166 100.000 36.224
Post-plating Pure metal layer Tin (Sn) 7440-31-5 9.169 99.990 0.634
Subtotal 9.169 99.990 0.634
Wire Additive Silicon (Si) 7440-21-3 0.002 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 0.198 99.000 0.014
Subtotal 0.200 100.000 0.014
Total 1446.976 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die attach
贴片材料
O O O O O O
Lead frame
引线框架
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Post-plating
后电镀
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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