B10H0710N40D
Download datasheetB10H0710N40D
Download datasheetLDMOS 2-stage integrated Doherty MMIC
The B10H0710N40D is a dual section 2-stage fully integrated Doherty MMIC solution using Ampleon's state of the art 50 V LDMOS technology. The carrier and peaking device, input splitter, output combiner and pre-match are integrated in each section. This multiband device is perfectly suited as general purpose driver in the frequency range 700 MHz to 1 GHz. Available in LGA outline.
Features and benefits
- Integrated input splitter
- Integrated output combiner
- Source impedance 50 Ω
- Pre-matched output
- No output circulator needed thanks to quad-combined configuration
- High linearity
- Designed for large RF and instantaneous bandwidth operation
- Independent control of carrier and peaking bias
- Integrated ESD protection
- High power gain
- For RoHS compliance see the product details on the Ampleon website
Applications
- 4G/5G macrocell base station driver
- 4G/5G microcell base station
Parametrics
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 700 | 1000 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 50 | W | |||
| Test signal: Pulsed CW | ||||||
| VDS | drain-source voltage | [0] | 48 | V | ||
| Gp | power gain | PL = 2.51 W (34 dBm) [0] | 27 | 31 | 35 | dB |
| ηD | drain efficiency | PL = 2.51 W (34 dBm) [0] | 20 | 25 | % | |
| ηD | drain efficiency | PL = PL(1db) [0] | 50 | 54 | % | |
| RLin | input return loss | PL = 2.51 W (34 dBm) [0] | -20 | -10 | dB | |
Package / Packing
| Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| B10H0710N40D | LGA-12x8 (LGA-12x8-34-2) |
lga-12x8-34-2_po | TR13; 3000-fold; 24 mm; dry pack | Active | Standard Marking |
B10H0710N40DX (9349 606 85525) |
|
| TR7; 500-fold; 24 mm; dry pack | Active | Standard Marking |
B10H0710N40DYZ (9349 606 85535) |
Pinning info
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 1 | n.c | not connected |
|
|
| 2 | n.c. | not connected | ||
| 3 | decoupling_A | video-lead for decoupling of section A | ||
| 4 | n.c. | not connected | ||
| 5 | VGS(carr) | gate-source voltage of carrier | ||
| 6 | VGS(peak) | gate-source voltage of peaking | ||
| 7 | n.c. | not connected | ||
| 8 | VDS1_A | drain-source voltage of driver stages of section A | ||
| 9 | n.c. | not connected | ||
| 10 | c.t.g. | connect to ground | ||
| 11 | RF_IN_A | RF input of section A | ||
| 12 | GND | ground | ||
| 13 | GND | ground | ||
| 14 | RF_IN_B | RF input of section B | ||
| 15 | c.t.g. | connected to ground | ||
| 16 | n.c. | not connected | ||
| 17 | VDS1_B | drain-source voltage of driver stages of section B | ||
| 18 | n.c. | not connected | ||
| 19 | VGS(peak) | gate-source voltage of peaking | ||
| 20 | VGS(carr) | gate-source voltage of carrier | ||
| 21 | n.c. | not connected | ||
| 22 | decoupling_B | video-lead for decoupling of section B | ||
| 23 | n.c. | not connected | ||
| 24 | n.c. | not connected | ||
| 25, 26, 27 | RF_OUT_B/VDS2_B | RF output and drain-source voltage of final stages of section B | ||
| 28 | n.c. | not connected | ||
| 29 | GND | ground | ||
| 30 | GND | ground | ||
| 31 | n.c. | not connected | ||
| 32, 33, 34 | RF_OUT_A/VDS2_A | RF output and drain-source voltage of final stages of section A |
Ordering & availability
| Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
|---|---|---|---|---|---|
| B10H0710N40D | 9349 606 85535 | B10H0710N40DYZ | DigiKey | Buy | Request samples |
| RFMW | Buy |
Ordering & availability
| Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
|---|---|---|---|---|---|
| B10H0710N40D | 9349 606 85535 | B10H0710N40DYZ | DigiKey | Buy | Request samples |
| RFMW | Buy |
Documentation
| Title | Type | Date | |
|---|---|---|---|
| LDMOS 2-stage integrated Doherty MMIC | Data sheet | 2023-09-11 | |
| Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-08-14 | |
| Packages for RF Power Transistors | Leaflet | 2024-03-25 | |
| LDMOS Ruggedness Reliability | Other type | 2017-03-28 | |
| Efficiency Improvement of LDMOS Transistors for Base Stations: Towards the Theoretical Limit | Other type | 2017-05-02 | |
| LDMOS Technology for RF Power Amplifiers | Other type | 2017-05-03 | |
| RF Power Solutions for Wireless Infrastructure | Brochure | 2024-04-04 |
Design support
| Title | Type | Date | |
|---|---|---|---|
| Printed-Circuit Board (PCB) B10H0710N40D (Data sheet) | Design support | 2023-10-02 |