Chemical content BLC9G24XS-170AV

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Type number Package Package
description
Total product
weight
BLC9G24XS-170AV SOT1275-1 DFM6 2540.450 mg
NC12 Effective Version Pb-free soldering Pb soldering Number of processing cycles Assembly site
MSL PPT MPPT MSL PPT MPPT
934960037517 2016-10-13 04 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
934960037518 2016-10-13 04 3 245 30 seconds 3 221 20 seconds 3 PH,South Luzon
Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
Cap Polymer Liquid Crystal Polymer (LCP) -natural- - 289.278 99.000 11.387
Epoxy Resin 115254-47-2 2.922 1.000 0.115
Subtotal 292.200 100.000 11.502
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.051 4.980 0.002
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.051 4.980 0.002
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.051 4.980 0.002
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.005 0.500 0.000
Doped silicon Silver (Ag) 7440-22-4 0.014 1.420 0.001
Aluminium (Al) 7429-90-5 0.018 1.740 0.001
Gold (Au) 7440-57-5 0.022 2.140 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.008 0.820 0.000
Silicon (Si) 7440-21-3 0.444 43.510 0.017
Silicon Dioxide (SiO2) 14808-60-7 0.005 0.520 0.000
Filler Silver (Ag) 7440-22-4 0.351 34.390 0.014
Subtotal 1.020 99.980 0.040
Die Pure metal layer Silver (Ag) 7440-22-4 0.015 1.030 0.001
Gold (Au) 7440-57-5 0.031 2.180 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.016 1.090 0.001
Gold (Au) 7440-57-5 0.041 2.850 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.063 4.380 0.002
Metal oxide Silicon Dioxide (SiO2) 14808-60-7 0.106 7.330 0.004
Gold alloy Tin (Sn) 7440-31-5 0.031 2.130 0.001
Gold (Au) 7440-57-5 0.328 22.770 0.013
Doped silicon Silicon (Si) 7440-21-3 0.798 55.400 0.031
Front metallisation Aluminium (Al) 7429-90-5 0.017 1.200 0.001
Subtotal 1.446 100.360 0.057
Die Pure metal layer Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.063 4.380 0.002
Gold (Au) 7440-57-5 0.031 2.180 0.001
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.016 1.090 0.001
Gold (Au) 7440-57-5 0.041 2.850 0.002
Silver (Ag) 7440-22-4 0.015 1.030 0.001
Metal oxide Silicon Dioxide (SiO2) 14808-60-7 0.106 7.330 0.004
Gold alloy Gold (Au) 7440-57-5 0.328 22.770 0.013
Tin (Sn) 7440-31-5 0.031 2.130 0.001
Doped silicon Silicon (Si) 7440-21-3 0.793 55.040 0.031
Front metallisation Aluminium (Al) 7429-90-5 0.017 1.200 0.001
Subtotal 1.441 100.000 0.057
Die Additive Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.102 4.990 0.004
Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.102 4.990 0.004
Polymer Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.102 4.990 0.004
Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.010 0.500 0.000
Doped silicon Silver (Ag) 7440-22-4 0.029 1.420 0.001
Aluminium (Al) 7429-90-5 0.036 1.750 0.001
Gold (Au) 7440-57-5 0.044 2.140 0.002
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.017 0.820 0.001
Silicon (Si) 7440-21-3 0.877 42.970 0.035
Silicon Dioxide (SiO2) 14808-60-7 0.021 1.040 0.001
Filler Silver (Ag) 7440-22-4 0.702 34.410 0.028
Subtotal 2.042 100.020 0.081
Die Additive Bisphenol-A/Epichlorohydrin/Carboxy terminated butadiene/Acrylonitrile polymer 68610-41-3 0.051 5.000 0.002
Aniline/4-[2-(4-hydroxyphenyl)propan-2-yl]phenol 67784-74-1 0.051 5.000 0.002
Polymer Bisphenol-A/Epichlorohydrin Epoxy resin (generic) 25068-38-6 0.005 0.500 0.000
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer 25036-25-3 0.051 5.000 0.002
Doped silicon Silicon Dioxide (SiO2) 14808-60-7 0.031 3.050 0.001
Silicon (Si) 7440-21-3 0.417 40.850 0.016
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.008 0.820 0.000
Gold (Au) 7440-57-5 0.022 2.140 0.001
Aluminium (Al) 7429-90-5 0.018 1.750 0.001
Silver (Ag) 7440-22-4 0.015 1.430 0.001
Filler Silver (Ag) 7440-22-4 0.351 34.370 0.014
Subtotal 1.020 99.910 0.040
Header Pure metal layer Palladium (Pd) 7440-05-3 0.182 0.010 0.007
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 2.186 0.120 0.086
Gold (Au) 7440-57-5 0.000 0.000 0.000
Silver (Ag) 7440-22-4 0.000 0.000 0.000
Copper alloy Phosphorous (P) 7723-14-0 0.547 0.030 0.022
Lead (Pb) 7439-92-1 0.000 0.000 0.000
Iron (Fe) 7439-89-6 1.822 0.100 0.072
Copper (Cu) 7440-50-8 1817.081 99.730 71.526
Subtotal 1821.818 99.990 71.713
 Ring frame Polymer Epoxy resin system - 5.992 1.430 0.236
Liquid Crystal Polymer (LCP) -natural- - 154.988 36.990 6.101
Pure metal Gold (Au) 7440-57-5 6.997 1.670 0.275
Cobalt (Co) 7440-48-4 2.388 0.570 0.094
Copper (Cu) 7440-50-8 238.998 57.040 9.408
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 9.595 2.290 0.378
Subtotal 418.958 99.990 16.492
Substance Pigment Not disclosed by Subco. - 0.500 100.000 0.020
Subtotal 0.500 100.000 0.020
Wire Additive Silicon (Si) 7440-21-3 0.000 1.000 0.000
Pure metal Aluminium (Al) 7429-90-5 0.005 99.000 0.000
Subtotal 0.005 100.000 0.000
Total 2540.450 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
Cap
封盖
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Die
裸晶
O O O O O O
Header
胶壳组装/封装
O O O O O O
 Ring frame
 环形框架
O O O O O O
Substance
材质
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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