Package version: SOT822-1
Package name: HSOP16
Package description: plastic, heatsink small outline package; 16 leads
Reference codes: -
Issue date: 2007-02-08
Type number Description Status Quick access
BLM6G10-30G W-CDMA 860 MHz to 960 MHz power MMIC End of life Download datasheet
BLM6G22-30G W-CDMA 2100 MHz to 2200 MHz power MMIC Production Download datasheet

Documentation

Title Type Date
Footprint for reflow soldering SOT822-1 Reflow soldering 2009-10-08
plastic, heatsink small outline package; 16 leads Outline drawing 2015-12-03