Chemical content BLP10H603

As a proactive and sustainable company, Ampleon has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Ampleon has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Ampleon products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number Package Package
description
Total product
weight
BLP10H603 SOT1352-1 Plastic thermal enhanced very thin small outline package; no leads; 12 terminals 71.666 mg
Orderable part number NC12 Effective Version Pb-free soldering Number of processing cycles Country of origin RoHS / RHF
MSL PPT MPPT
BLP10H603Z 934068213515 2024-02-02 07 3 245 30 seconds 3 KR
BLP10H603AZ 934068213531 2024-02-02 07 3 245 30 seconds 3 KR
Quality and reliability disclaimer

Subpart Material
group
Substances CAS number Mass (mg) Mass (%) of
subpart
Mass (%) of
total product
ADHESIVE N/A Not disclosed by Subco. - 0.013 1.500 0.018
Polymer Bisphenol-F/Formaldehyde/Epichlorohydrin copolymer 9003-36-5 0.117 14.000 0.163
Filler 2-[[4-(1.1-dimethylethyl)phenoxy]methyl]-oxirane 3101-60-8 0.058 7.000 0.081
Dicyandiamide (generic) 461-58-5 0.004 0.500 0.006
Pure metal Silver (Ag) 7440-22-4 0.630 75.500 0.879
Subtotal 0.822 98.500 1.147
Die Doped silicon Silicon (Si) 7440-21-3 2.869 100.000 4.003
Subtotal 2.869 100.000 4.003
Lead frame Copper alloy Silver (Ag) 7440-22-4 0.007 0.020 0.010
Gold (Au) 7440-57-5 0.010 0.030 0.014
Copper (Cu) 7440-50-8 0.435 1.280 0.607
Iron (Fe) 7439-89-6 0.789 2.320 1.101
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 32.674 96.100 45.584
Lead (Pb) 7439-92-1 0.000 0.000 0.000
Palladium (Pd) 7440-05-3 0.017 0.050 0.024
Phosphorous (P) 7723-14-0 0.027 0.080 0.038
Zinc (Zn) 7440-66-6 0.041 0.120 0.057
Subtotal 34.000 100.000 47.435
Mold Compound Pigment Carbon black 1333-86-4 0.101 0.300 0.141
Polymer Phenolic resin - 0.843 2.500 1.176
Epoxy Resin 115254-47-2 2.022 6.000 2.821
Filler Silica fused 60676-86-0 28.881 85.700 40.292
Silica -amorphous- 7631-86-9 1.854 5.500 2.587
Subtotal 33.701 100.000 47.017
Wire Pure metal Gold (Au) 7440-57-5 0.274 100.000 0.382
Subtotal 0.274 100.000 0.382
Total 71.666 100.0 100.0
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Name of the part
部件名称
铅(Pb) 镉(Cd) 汞(Hg) 六价铬(Cr-VI) >多溴联苯(PBB) 多溴二苯醚(PBDE)
ADHESIVE
O O O O O O
Die
裸晶
O O O O O O
Lead frame
引线框架
O O O O O O
Mold Compound
注塑胶料
O O O O O O
Wire
线
O O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Ampleon products have an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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